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IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 1 > 92 - 97
IEEE Transactions on Electron Devices > 2011 > 58 > 11 > 3736 - 3742
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 10 > 1497 - 1507
IEEE Transactions on Electron Devices > 2011 > 58 > 10 > 3549 - 3558
IEEE Electron Device Letters > 2011 > 32 > 8 > 1131 - 1133
IEEE Transactions on Electron Devices > 2011 > 58 > 8 > 2752 - 2758
IEEE Electron Device Letters > 2011 > 32 > 10 > 1319 - 1321
IEEE Electron Device Letters > 2011 > 32 > 9 > 1245 - 1247
IEEE Transactions on Electron Devices > 2010 > 57 > 10 > 2719 - 2725
IEEE Electron Device Letters > 2010 > 31 > 12 > 1479 - 1481
IEEE Transactions on Dielectrics and Electrical Insulation > 2010 > 17 > 3 > 694 - 700
IEEE Transactions on Electron Devices > 2010 > 57 > 9 > 2296 - 2305
IEEE Transactions on Dielectrics and Electrical Insulation > 2010 > 17 > 4 > 1319 - 1326
IEEE Transactions on Dielectrics and Electrical Insulation > 2010 > 17 > 4 > 1043 - 1049
IEEE Electron Device Letters > 2010 > 31 > 9 > 1032 - 1034
IEEE Transactions on Power Delivery > 2010 > 25 > 2 > 770 - 779
IEEE Electron Device Letters > 2010 > 31 > 5 > 396 - 398
IEEE Electron Device Letters > 2010 > 31 > 5 > 440 - 442
IEEE Transactions on Plasma Science > 2010 > 38 > 8-2 > 1885 - 1891
IEEE Transactions on Device and Materials Reliability > 2010 > 10 > 3 > 307 - 316