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IEEE Transactions on Electron Devices > 2017 > 64 > 3 > 923 - 929
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 1 > 52 - 58
IEEE Electron Device Letters > 2017 > 38 > 2 > 160 - 163
Journal of Microelectromechanical Systems > 2017 > 26 > 1 > 283 - 294
IEEE Transactions on Dielectrics and Electrical Insulation > 2017 > 24 > 1 > 437 - 454
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 2 > 229 - 237
IEEE Transactions on Circuits and Systems I: Regular Papers > 2016 > 63 > 12 > 2381 - 2392
IEEE Transactions on Electron Devices > 2016 > 63 > 12 > 4852 - 4859
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2016 > 35 > 11 > 1811 - 1824
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 10 > 1567 - 1575
IEEE Transactions on Power Electronics > 2016 > 31 > 9 > 6405 - 6415
IEEE Transactions on Device and Materials Reliability > 2016 > 16 > 3 > 402 - 412
IEEE Transactions on Electron Devices > 2016 > 63 > 7 > 2643 - 2649
IEEE Transactions on Magnetics > 2016 > 52 > 7 > 1 - 4
IEEE Transactions on Magnetics > 2016 > 52 > 7 > 1 - 4
IEEE Photonics Journal > 2016 > 8 > 3 > 1 - 12
IEEE Transactions on Reliability > 2016 > 65 > 2 > 1022 - 1029
IEEE Transactions on Applied Superconductivity > 2016 > 26 > 4 > 1 - 4
IEEE Transactions on Power Electronics > 2016 > 31 > 5 > 3482 - 3494
IEEE Transactions on Geoscience and Remote Sensing > 2016 > 54 > 5 > 2543 - 2551