Search results
IEEE Electron Device Letters > 2016 > 37 > 9 > 1211 - 1214
IEEE Transactions on Electron Devices > 2016 > 63 > 8 > 2987 - 2993
IEEE Electron Device Letters > 2016 > 37 > 8 > 1010 - 1013
IEEE Electron Device Letters > 2016 > 37 > 8 > 1006 - 1009
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2016 > 24 > 8 > 2712 - 2725
Journal of Zhejiang University-SCIENCE A > 2016 > 17 > 7 > 525-540
IEEE Transactions on Reliability > 2016 > 65 > 2 > 941 - 956
IEEE Transactions on Applied Superconductivity > 2016 > 26 > 4 > 1 - 6
IEEE Transactions on Dielectrics and Electrical Insulation > 2016 > 23 > 3 > 1251 - 1259
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2367 - 2373
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2384 - 2390
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2391 - 2397
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2334 - 2339
IEEE Transactions on Device and Materials Reliability > 2016 > 16 > 2 > 213 - 219
IEEE Transactions on Industry Applications > 2016 > 52 > 3 > 2554 - 2563
IEEE Electron Device Letters > 2016 > 37 > 5 > 611 - 614
IEEE Electron Device Letters > 2016 > 37 > 5 > 644 - 647
IEEE Transactions on Applied Superconductivity > 2016 > 26 > 3 > 1 - 5
IEEE Transactions on Nuclear Science > 2016 > 63 > 2-3 > 1268 - 1275
IEEE Transactions on Nuclear Science > 2016 > 63 > 2-3 > 1276 - 1283