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Ever since its prediction, experimental investigation of the Casimir force has been of great scientific interest. Many research groups have successfully attempted quantifying the force with different device geometries; however measurement of the Casimir force between parallel plates with sub-micron separation distance is still a demanding task, since it becomes extremely difficult to maintain sufficient...
A single-sided micromachined TPMS sensor is proposed and fabricated for automobiles, which is with a piezoresistive pressure sensor and a cantilever-mass piezoresistive accelerometer monolithically integrated in a 1.6mm×1.5mm sized (111) silicon chip. Single-wafer-based front-side silicon micromachining and metal electroplating technologies are employed to fabricate the device. Specially designed...
An inductively coupled plasma ion source based micro machining system is being developed. The system parameters, in which mainly the source parameters like brightness, ion energy spread and source size, are optimized for increasing the efficiency of the system. Preliminary tests show 6 KeV Argon ion beam focused to 1.4 micron size with current density 600 mA/cm2. Possibilities of micro fabrication...
This paper describes the possibility of the crystalline anisotropic etching of single-crystal silicon using a fully dry etching process. Conventionally, the crystalline anisotropic etching of silicon has been achieved only using specific wet solutions. In the proposed method, the anisotropic etching is made dominant by controlling the etching energy under specific dry etching conditions. The maximum...
Current crowding of a micro spring pressure contact under high current is studied. The spring conducts >; 250 mA electrical current between chips, has large mechanical compliance (>; 30 μm) compared to other packaging technologies, and fits in a 180 μm pitch 2d array. At 250 mA and 65°C, daisy chains of 134 spring contacts in a silicon package show stable resistances and hot spot temperature...
This paper reports gamma irradiation effects on the resistance of polycrystalline silicon beams in MEMS. Co60 irradiation test was performed to reveal mechanisms underlying radiation effects. Changes of the resistances have been measured by Semiconductor Characterization Instruments. The mechanisms of gamma irradiation effects on the resistance of polycrystalline silicon were discussed in detail....
This study designs and fabricates a suspending antenna on silicon substrate with backside electromagnetic band-gap (EBG) structures using surface and bulk micromachining techniques. The proposed Si-based antenna with dimension 7 mm × 18 mm × 0.5 mm only and is constructed of a ground copper plane, supporting copper vias, a suspending F-shape copper conducting layer and backside silicon cavities (to...
This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by...
We use the surfactant-modified wet anisotropic etching, a promising micromachining technique we have recently focused on, to fabricate sharp silicon tips with high aspect ratio without additional sharpening by thermal oxidation. Because of the intriguing variation of etching characteristics in surfactant-added solutions as compared to traditional etchants, tips possessing a front angle of about 18°...
A novel micromachined thermopile IR detector module with filter and detector cointegrated by wafer level Au-Au vacuum bonding is presented in this paper. Filter is directly bonded on the IR detector to miniaturize the detector module, as well as reduce the packaging cost. Because the gas convection will be eliminated in vacuum, a better thermal isolation can be achieved for the vacuum packaged IR...
High-density piezoelectric micromachined ultrasonic transducer (pMUT) arrays have been designed and fabricated using silicon based micromachined process. These devices are based on a novel structure called “reverse-bonding”. Experimental results show that they have excellent performance, suitable resonance frequency and high reliability. The fabricated pMUT arrays are very promising for 3-D medical...
We are introducing an innovative sacrificial surface micromachining process that enhances the robustness of freestanding microstructures and compliant mechanisms. Fabrication of a compliant mechanism using conventional sacrificial surface micromachining results in a non-planar structure with a step between the structure and its anchor. During mechanism actuation or assembly, stress accumulation at...
This paper reports the fabrication and characterization results of a silicon micro mirror fabricated by integrated of top-down fabrication of CNTs thin film and conventional micromachining. The silicon mirror is suspended by CNT hinge and actuated by using electrostatic force through angular vertical comb system. The performance of the mirror had been characterized. Thanks to the excellent mechanical...
A photonic crystal slab waveguide (PhC-WG) with an integrated MEMS bimorph cantilever actuator has been successfully fabricated using deep UV lithography and surface micromaching techniques. The cantilever is equipped with tips that are self-aligned with respect to the holes of the PhC-WG such that on electrostatic actuation, with modest voltages of less than 10 V, these tips move into the holes....
This paper reports a method for integrating and micromachining spherical structures made from materials such as fused quartz that are not amenable to melting or reflow. The 3D-SOULE process combines batch-mode micro ultrasonic machining (μUSM), lapping, and micro electro-discharge machining (μEDM) for creating spherical structures. Micro electro discharge machining is used for creating the stainless...
In this paper we report on two methods of fabricating Frequency Selective Surfaces (FSS) which are designed to give a polarisation independent band pass filter response centred at 321 GHz. One of the designs is based on metal encapsulated polymer while a later version uses silicon on insulator (SOI) as the structural material. The fabrication of the devices was carried out in a clean room laboratory...
An optical probe is developed for imaging in an optical coherence tomography (OCT) system and a 3D micro mirror is used for moving the beam from the source to the point of interest on the sample. The completed probe uses a dual axis electro-thermal actuated mirror, silicon optical bench (SiOB)-based probe. The silicon optical bench is designed and micro machined to assemble the fiber, lens and the...
A process for simultaneous surface treatment, micromachining and copper deposition on silicon wafer is reported here. The process addresses three issues viz. surface treatment, micromachining to form microchannels and subsequent copper deposition into this microchannel on silicon surface simultaneously. The suggested process is based on the electrochemical spark phenomenon. At a time, in its conventional...
A novel, optical approach to the interrogation of MEMS cantilever sensors is discussed. We investigate the effects of placing a diffraction grating in a Si waveguide below a cantilever arm, to create a resonant cavity which will create interference on an optical signal through the waveguide. We look at FDTD simulations of the optical power transmitted through this device as the cantilever's height...
This paper reports on the development and characterization of a novel CMOS-based, low-cost, high-pressure sensor with inherent overload protection. The sensor consists of an anodically bonded silicon-Pyrex stack with surface trenches micromachined into the CMOS substrate. Due to the difference in elastic moduli of silicon and Pyrex, an applied hydrostatic pressure causes an anisotropic stress distribution...
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