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A high-sensitivity and self-biased MEMS magnetic sensor based on ferromagnetic-piezoelectric composites has been fabricated and characterized. Series of MEMS processes including silicon-quartz lower temperature eutectic bonding, quartz wafer thinning, electroplating of thick nickel thin films, etc., have been successfully demonstrated in creation of a quartz-nickel cantilever structure. Moreover,...
Improvements in thin-film piezoelectric materials such as AlN and PZT enable piezoelectric micromachined transducers that are superior to existing capacitive transducers. This paper presents the basic design equations, equivalent circuit model, and fabrication processes for piezoelectric micromachined ultrasonic transducers (PMUTs) operating in fluid or air. Relative to conventional ultrasonic transducers,...
Unexploited ambient vibration is scattered in the environment such as in the building, transportation, equipment or on the street. This untapped waste energy is low and varying in frequency and amplitude value. The wideband frequency MEMS Vibration Energy Harvesting (MVEH) is one of the preferable designs in harvesting or scavenging this ambient vibration energy. The energy harvested will be used...
The article presented research results of stressed and strained state of sensitive element of MEMS sensor depending on the pressure applied. A code for the ANSYS system was developed allowing to automate the process of constructing a solid model of pressure sensor and stressed and deformed state, taking into account technological features of their production. As a result of the program processing...
In early stage of the design process, modeling is a crucial phase as it allows the designer estimating the device performance. Very often, this phase is time-consuming, especially when FEM simulator is used. Hence, a fast and reliable method is desirable. Moreover, in case of simple structures which behavior is described with quite simple equations, the use of analytical model is obvious. In this...
In this paper, two different micron-scale negative refraction index metamaterials with fine flexibility are proposed. The proposed metamaterials are composed of “Quasi-S” structure and “H” structure respectively. Different from conventional metamaterials, the designs proposed in this paper apply to perpendicular incident waves. Both metamaterials are designed and optimized for sub-terahertz application...
Most of the MEMS inertial switches developed in recent years are intended for shock and impact sensing above 40 g. These switches are fabricated based on non-silicon surface micromachining with multiple steps of electroplating. In this paper, a silicon based low-g inertial switch typically used for linear acceleration sensing is designed and fabricated. The inertial switch consists of a high volume...
This paper reports a packaged MEMS capacitive pressure sensor based 3C-SiC using bulk-micromachining technology that operates on the pressure up to 5.0 MPa and temperature up to 500 ºC. The diaphragm employs a single-crystal 3C-SiC thin film that is back-etched from its Si substrate. A photosensitive ProTEK PSB is used as a protection mask layer to reduce the process steps. We compare our results...
A terahertz(THz) diagonal multi-layer horn antenna is proposed. The proposed antenna is composed of several silicon layers, monolithically fabricated by dry etching, and sputtering gold and gold-gold thermo-compression bonding. The input return loss shows a level below −8dB from 480 to 500GHz. The gaussicity of radiation patterns at the working band is calculated to be 92%. The proposed antenna exhibits...
This paper describes a comparative study of sensitivity and non-linearity of conventional and bossed diaphragm piezoresistive pressure sensor along with a performance enhanced design. The proposed structures take into consideration corner compensation to avoid distortion of the mesa structure during fabrication of bossed diaphragm structure using wet bulk micromachining. Optimum piezoresistors locations...
The Robert Bosch GmbH is the world's largest supplier of micromechanical sensors in automotive and consumer applications. Achieving a high quality and cost effectiveness in automotive and consumer applications an advanced design flow is required to fulfill these criteria. In here a method and algorithm is presented to ensure a high functionality and yields of micromechanical sensors.
Processes that define the cantilever sensor from the front side of the wafer are designed to release the stress of the buried oxide layer and top silicon layer. This approach can be applied to enhance the performance of all the cantilever-based sensors. Then, a novel cantilever array sensor was microfabricated for precise bio-marker detection.
For many decades, transistorized logic has been the foundational design of computing, which relies on simple representations of 1's and 0's in the binary language. However, binary strings can be symbolized through other various methods besides transistors, like with techniques utilized in magnetic and optical data storage media. Utilizing microelectromechanical systems (MEMS) technology based on the...
Buckled membranes are commonly used in microelectromechanical systems (MEMS) structures. One application of a microfabricated membrane is pressure sensing. A differential pressure across the membrane causes deflection, up or down, which can be measured and related to a specific pressure change. Recent work has demonstrated that the deflection and stiffness of these membranes can be tuned through localized...
We present the design and implementation of an analog front-end for smart-sensors and measurement results with prototypes of acceleration micro-sensors. The technology used for sensor manufacturing features silicon nanowires as strain gauges. The proposed system supports Kelvin contacts scheme and sensor bias duty-cycling. A fully-differential amplifier with a sensor-degenerated common-mode rejection...
We present a new type of acoustic resonator technology aimed to undoing the technological locks encountered during the realization of capacitive silicon MEMS resonators exploiting true Bulk Acoustic Wave resonances instead of structural ones. The single-crystal silicon resonators are driven through a combination of a static bias and dynamic voltage applied across a 700 nm-thick electrostatic gap parallel...
We experimentally demonstrate the use of simple MEMS microcantilevers as an efficient way to achieve dynamic manipulation of terahertz waves. An array of subwavelength sized microcantilevers acts as metamaterial, which can be electrostatically tuned to provide active control of light-matter interaction. The proposed metamaterial shows tuning range of 0.3 THz, which is further improved to 0.36 THz,...
A piezoelectric MEMS with wake up function, Power down interrupt generator (PDIG), for inertial sensor systems is reported. The aluminum nitride based MEMS generates electric signals intrinsically in result of an inertial accelerations. The PDIG is optimized for maximum charge and voltage sensitivity. The charge sensitivity for a single electrode designed PDIG is measured with 40.1 pC/g and the maximum...
A new optical MEMS silicon pressure sensor for use in high temperature (up to 450°C) and high radiation environments has been developed. Preliminary tests of the pressure sensor integrated with the components of the optical detection system and software has showed accurate detection of pressure by purely optical system.
3D manufacturing at micron scale with very low roughness is a key enabling technology for the realization of micromechanical parts both for mechanical devices and for critical components such as printer head nozzles and high precision molds. The only currently available technique in the field of IC micro technology is nanolithography by two photon absorption [1]. We report the implementation of a...
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