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WLCSP (wafer level chip scale package) has been well accepted within modern industry which brings not only the reduction of package size, but also good thermal performance vs. more traditional peripherally leaded packages. At the mean time, WLCSP feathers can significantly lower manufacturing costs. One of the barriers for WLCSP package to be accepted in the industry is the lack of existing and mature...
The TID Co60 Dose rate effects have been examined in bipolar transistors at high and low dose rates. The aim of the radiation tests is to study the ELDRs on NPN and SPNP elementary transistors.
The complexity of an image tells many aspects of the image content and is an important factor in the selection of source material for testing various image processing methods. We explore objective measures of complexity that are based on compression. We show that spatial information (SI) measures strongly correlate with compression-based complexity measures. Among the commonly used SI measures, the...
Numerous ontological or semantic similarity measures have been proposed to determine how similar one concept is to another within the context of an ontology. These measures are shown to have as their basis fuzzy set compatibility measures and have been used in a variety of biomedical and bioinformatics applications. In this paper a new matcher, the mediating matcher with semantic similarity (MMSS),...
Heterojunction bipolar transistors in silicon using a narrow band gap base (e.g. Si/SiGe/Si) are well known and have been in production for many years. However a wide bandgap emitter on silicon has proved elusive (Fig 1(a)). Recently it has been shown that heterojunctions between crystalline silicon and organic semiconductors such as PEDOT or P3HT can block electrons from entering the organic [1,...
This paper considers the causal cognitive interference channel that consists of two full-duplex transmitter-receiver pairs sharing the same channel, where one transmitter can causally learn the message of the other transmitter through a noisy link. This channel models unilateral source cooperation. The work focuses on the generalized degrees-of-freedom of the symmetric, i.e. the two interfering links...
In the evolution of IC package, the primary trend is regarded to be the upgrading from planar 2D integration to 3D stacking. But before stepping into 3D IC category, a transitional generation called 2.5D is proposed. Due to the extremely fine pitch of modern IC, the IC substrate is difficult to match due to the incomparable line width/space. Therefore, a silicon interposer is introduced to fulfill...
TTSV is proposed for the removal of heat from between the IC layers as these TTSVs carries heat down to the sink. However, it may generate stress in Silicon. In the present paper, thermal-stress simulation of stack consists of three IC layers bonded face up is performed using finite element modeling tools. We also analyzed the stress generated in 3D IC containing TTSV. Further we proposed a method...
In this paper, two compact wideband bandpass filters are developed with various operating bandwidths and fabricated on the silicon interposer, which is often used to connect the dies/chips of different functions using 3-D integrated circuit (3-D IC) packaging technique. To fully utilize the advantage of silicon interposer, the proposed filters are designed based on through-silicon-vias (TSVs) to miniaturize...
The mounting issues of decreased yield and reliability from nanoscale integrated circuit (IC) processes require advanced approaches to the measurement and mitigation of device degradation and variance. Shrinking process geometries, with their corresponding reduction in device lifetimes, have broad implications to critical applications having long intended design lifetimes and are a major concern to...
To find out the root causes of yield loss is always expensive and time-consuming. In this paper, we have developed an in-house flow of volume diagnosis. With the power of performing statistical analysis on the large volume of diagnosis results, we demonstrate that to do physical failure analysis could be in a more economical way. By utilizing the in-house flow of volume diagnosis, we could find out...
This paper reports an alternative simple fabrication process for twin gate junctionless Vertical Slit Field Effect Transistors. N-type devices have been successfully manufactured on SOI substrates with a doping density 5×1018 atoms/cm3. The devices demonstrate up to six decades of Ion/Ioff ratio and a sub-threshold swing of 90 mV/decade relative to a slit width of approximately 10 nm.
An interposer-based three-dimensional integrated circuit, which introduces a silicon interposer as an interface between chips and a package, is one of the most promising integration technologies for modern and next-generation circuit designs. Inter-chip connections can be routed on the interposer by chip-scale wires to enhance design quality. However, its design complexity increases dramatically due...
We integrated superconducting nanowire single-photon detectors on sub-400-nm-thick silicon nitride membranes, which can then be transferred and aligned to photonic structures on a secondary chip with sub-micron placement accuracy.
In this paper a two-dimensional transient thermal model of the rotor of an induction motor during reactor starting is presented using finite element formulation and arch-shaped elements. Excepting for providing a more accurate representation of the problem, the proposed model can also reduce computing costs. A temperature-time method is employed to evaluate the distribution of loss in various parts...
There are many attributes related to dependability: availability and reliability, confidentiality, integrity and maintainability. To design a "dependable" SOC could mean one or all of the following: fault tolerant design, redundancy design, "design for security" or simply to improve silicon validation in order to produce a more robust chip. In this paper, the author is going to...
Integrated voltage regulators (IVRs) promise to improve performance-per-watt for microprocessors and systems-on-chip by reducing supply voltage margins, resistive losses in the power distribution network, and by enabling power management with greater temporal resolution. However, the thermal impact of IVRs has not been well studied, and the methodologies for thermal analysis of analog/digital mixed-signal...
In the applications of hybrid electrical vehicle (HEV) and electrical vehicle (EV) power systems, the permanent magnet synchronous machines (PMSM) provide better torque generating capabilities, higher power density and higher power conversion efficiency. This paper develops the permanent magnet synchronous generator (PMSG) drive for the electrical vehicle. The PMSM can be driven in both motor mode...
We show that the capacity region of the state-dependent multiple-access channel (SD-MAC) with strictly-causally cribbing encoders is not enlarged if strictly-causal state-information (SI) and feedback are furnished to the encoders. We also derive the capacity region of the SD-MAC with causal SI at the cribbing encoders and show that Shannon strategies are optimal. Such strategies are generally suboptimal...
The article describes the development of the new design of the X-ray detector with direct conversion. A storage capacitor and a key-based field-effect transistor are created in each of the pixel detectors. The control of the key is carried out by applying the pulses to the gates of the transistors combined in the matrix columns the charge of the key pixels is removed from the rows of the matrix, respectively.
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