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Extremely thin silicon-on-insulator (ETSOI) structure has been developed to improve gate control and to suppress the short-channel effect (SCE) associated with bulk MOSFET. However, since self-heating in ETSOI may compromise both performance and reliability, a careful analysis of the trade-off between short-channel control and self-heating is needed. In this paper, we (i) characterize channel and...
Cloud computing is now trending and more popular in these days for the computation and adopted by many companies like google, amazon, Microsoft etc., As the cloud size increases with increase in number of data center power consumption over a data center increases. As number of request over the data center increase with increase in load and power consumption of the data center. So the requests need...
Micro-fluid cooling solution is one of the most effective techniques for thermal management of high heat fluxes. A jet-based Si micro-cooler with multiple drainage micro-trenches has been developed for micro-electronic thermal management. An inlet/outlet flow arrangement layer has been introduced to achieve uniform pressure distribution for each nozzle. The effect of three types of arrangement structures...
Thermal management of 3D IC is an important factor in terms of performance and reliability. In this study, the feasibility of Cu TSV as a heat dissipation path was experimentally investigated. 40 μm thick Si wafer was point-heated at 50 °, 100 °, 150 ° and 200 ° and surface temperature profile on the other side was observed using IR microscope. Specimens with TSV showed higher maximum temperature...
Thermal characterization of large multi-finger AlGaN/GaN Schottky Barrier Diodes (SBDs) fabricated on GaN-on-Si high voltage power substrates is reported. An accurate thermal model was developed for the device structure to estimate the device temperature near the 2-DEG in HEMT switches for various power densities. Raman thermography and infrared imaging were used under DC bias conditions for temperature...
Effective power distribution methodology is one of the basic necessities to meet the increasing power demand in any power system. Load shedding is done when power demand is more than power generation, to sustain the power system stability. Load shedding methods followed today shed a particular load completely, neglecting the critical consumers within the system. Controlling the loads at individual...
This paper reports the implementation of a low-cost double-sacrificial-layer uncooled infrared microbolometer in a standard 0.5 µm CMOS process, where the CMOS metal interconnect layer is used as the infrared sensitive material. The microbolometer can be created by simple surface sacrificial layer technology after the CMOS fabrication, without any additional lithography and infrared sensitive material...
The concept of single input — multi output (SIMO) sensors is investigated for the purpose of chemical sensing and more precisely gas sensing. The measurement of a single gas is coupled to different outputs, each involving various transduction mechanisms. The concept is especially matched to gas sensing via selective adsorbing mechanism in an active layer, the mass or the electrical polarization of...
This paper presents the electrical characterization of low power CIGSSe photovoltaic (PV) modules. Such investigation is achieved to perform a comparison of their performances with conventional silicon PV modules. For this purpose, a test bench, suitable for the characterization of both traditional and innovative low power modules, has been set-up and experimental results are accurately described...
Limitation on power budget in many-core systems leaves a fraction of on-chip resources inactive, referred to as dark silicon. In such systems, an efficient run-time application mapping approach can considerably enhance resource utilization and mitigate the dark silicon phenomenon. In this paper, we propose a dark silicon aware runtime application mapping approach that patterns active cores alongside...
In this paper we present a novel SOI CMOS multidirectional thermoelectric flow sensor. For the first time to the best knowledge of the authors, the sensor is shown to be able to cope with harsh environment conditions, such as 150 °C ambient temperature and humidity up to 75%.
This paper tackles the audio visual renderings of geolocated datasets harvested from social networks. These datasets are noisy, multimodal and heterogeneous by nature, providing different fields of information. We focus here on the information of location (GPS), time (timestamp) and text from tweets from which sentiment is extracted. We provide two ways for visualising datasets and for which demos...
Through-silicon via (TSV) based 3-D ICs provide a promising solution for miniaturizing chips. However, thermal issue in 3-D ICs cannot be ignored. In this paper, we proposed a method based on 3-D transmission line matrix (3-D TLM) method to calculate heat generation in the lossy silicon substrate caused by TSV induced electrical field. Pseudo random bit sequences (PRBS) at different bit rates are...
A silicon-silica hybrid 1×8 optical phased-array switch is fabricated with a multi-chip integration technique. We achieved a high switching response of 81 μsec, a high extinction ratio of over 18 dB and a low insertion loss of 4.9–8.1 dB at a wavelength of 1.55 μm.
We apply a unique three-dimensional (3D) physics-based atomistic simulator to study silicon-rich (SiOx, x<2) resistive switching nonvolatile memory (RRAM) devices. We couple self-consistently a simulation of ion and electron transport to the ‘atomistic’ simulator GARAND and a selfheating model to explore the switching processes in these structures. The simulation model is more advanced than other...
In modern power semiconductor devices, the top side of the semiconductor is usually connected by bond wires. Thus top side cooling becomes impossible. This work presents the implementation and the thermal performance of a micro heat sink that allows effective fluid cooling of power semiconductors on both sides of the chip. The micro heat sink is printed directly onto the metalization of the silicon...
Silicon super-junction MOSFETs have very low on-state resistances and fast switching characteristics. However, their use in voltage-source converters is hindered by the poor reverse recovery performance of their body drain diode and an adverse output capacitance characteristic. These both act to increase the overall switching loss. The on-state resistance and output capacitance characteristics of...
To investigate self-heating effects in double gate MOSFETs, a simulator solving self-consistently the Boltzmann transport equations (BTE) for both electrons and phonons has been developed. A Monte Carlo (MC) solver for electrons is coupled with a direct solver for the phonon transport. This method is particularly efficient to evaluate accurately the phonon emission and absorption spectra in both real...
We investigated wavelength-control-characteristics of a silicon photonic transmitter employing heater-integrated silicon micro-ring-modulator and flip-chip integrated CMOS driver. A novel wavelength control successfully demonstrated error-free operation at 25 Gbps during wide-package-temperature cycle between 20 and 60ºC for the first time.
Optical switches based on multimode interference (MMI) couplers can reduce footprint and increase tolerance against fabrication deviations. Furthermore, a 50% power consumption reduction has been demonstrated by designing a trenched MMI for thermal isolation without penalizing insertion losses and crosstalk.
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