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In this paper, we propose an facile one-step reduction approach free of microwave-assisted heating or water-bath heating to synthesize Ag-Cu nanoparticles (NPs). Results showed that fcc Ag-Cu NPs with an ultra-fine average size of 9 nm were achieved and expected to sinter at about 330 °C which is much lower than the eutectic temperature of bulk Ag-Cu alloy (779 °C) according to the analysis of TG/DSC...
A novel method for the evaluation of thermal conductivity of paste materials is proposed in this paper. The principle is based on the measurement of the thermal conductivity of composite materials together with finite element modeling (FEM). In the present study, the FEM based on the structure and working principle of an apparatus (THISYS) used for measuring the thermal conductivity of thin and solid...
As the weakest parts in through silicon via (TSV) structures, solder bump joints bear cyclic thermal stresses under power cycling in service, which contribute to the fatigue of them. Meanwhile, the dimensions of solder bump joints keep shrinking due to the miniaturization of electronic systems and products. The size effect can have significant influence on thermal fatigue behavior of the joints. In...
Silicone-cycloaliphatic epoxy resins were successfully synthesized by a two-step reaction route: (i)hydrosilylation of 1,3,5,7-tetramethylcyclotetrasiloxane (TMCTS) and 2-epoxy-4-vinyl-cyclohexane,and then blocking of unreacted Si-H with n-butanol, (ii) In order to reduce the viscosity, different amounts of active diluent(Allyl Glycidyl Ether) was added into(i). The molecular structures of the hydrosilylation...
Self-propagating exothermic reaction of Al/Ni multilayer film has been developed as a heat source with small heat region and high reaction rate in the field of bonding. In this paper, using this kind of localized and rapid heat source, solder preforms with different melting point such as SAC305 (217°C), Au80Sn20 (278°C) and A88Ge12 (356°C) have been applied to achieve the Si/Si bonding includes stacked...
Silicon has been the Holy Grail of modern electronics since the invention of the Si transistor followed by the Si Integrated circuit in the 1950s. It is now the basis of terrestrial photovoltaic (PV) devices and systems which provide a viable means to combat global climate change. As such the requirement of Polysilicon has grown by orders of magnitude to tens of thousands of tonnes per annum to meet...
We present experimental results of thermally tunable double ring resonators with doped silicon and silicide heaters and different geometries. We study the effects of fabrication inaccuracies which affect the symmetry of the heating, and we show how spectra are recovered when asymmetry is electrically compensated.
To alleviate interconnect scaling problem, Network-on-Chip (NoC) has evolved as a standard to design advanced Multiprocessor System-on-Chip (MPSoC). Furthermore, three-dimensional (3D) integration has been proposed recently as an alternative to meet interconnection scaling demands. To design three-dimensional NoC (3D NoC) based systems, the communication channel across vertical direction of an extended...
This research describes the p-type nanostalactites (p-type NS) with high photothermal conversion capability has been demonstrated by rapid INC process without extra heat treatment. In optical property, p-type NS has ultralow reflectance below 5 % and high light absorption due to rough structures in the broadband wavelength (350 nm–1100 nm). It looks like a black body. Silicon, an indirect band material,...
In conventional control system, crowning growth process has little consideration on controlling the microscopic quality of silicon crystal ingot. Phenomena of diameter fluctuation is observed and analyzed. Based on the cause of diameter fluctuation, a model based predictive control approach is proposed. Generalized Predictive Control (GPC) algorithm is used in the temperature feedforward path of crystal...
Thermal heat/phonon transport in single-crystalline Si and amorphous SiGe phononic crystal (PnC) nanos- tructures was investigated at room temperature. Thermal conductivities were compared between hexagonal-lattice PnCs, which have staggered alignment of circular holes, and square-lattice PnCs. In microscale structures, where thermal transport is diffusive, no difference can be expected. However,...
This paper develops a simplified dependency model for sources on social networks that is shown to improve the quality of fact-finding -- assessing veracity of observations shared on social media. Recent literature developed a mathematical approach for exploiting social networks, such as Twitter, as noisy sensor networks that report observations on the state of the physical world. It was shown that...
High efficiency white LEDs are expected to take the place of conventional lamps for general lighting applications. High junction temperature is one of the key parameters that affects both electrical and optical properties. In this work, effects of phosphor distribution on junction temperature reduction is studied. The results showed that, if proper phosphor distribution is ensured so that they form...
On-chip integration of quartz resonators with Si devices opens new opportunities for microsystem miniaturization and enhanced performance. In addition to integrating with electronics, the integration of piezoelectric quartz resonators with other sensors of different material composition is also possible. In this paper, we demonstrate that a VHF SC-cut quartz resonator can be integrated within a high-aspect-ratio...
In this work, investigations on stress development in electrically conductive adhesives used as a die-attachment technology for electronic devices are presented. Three electrically conductive adhesives and two measurement techniques were used for investigations. A silicon stress chip with NiCr-thin film metallic strain-gauge structures developed in our group is used for determination of stress development...
In this study we established a new process of the bonding and debonidng of the glasses for the handling of the ultra thin glass substrates. On the basis of the Surface Activated Bonding (SAB) method, the glasses were bonded using the Si and Fe intermediate layers at room temperature. The bond strength was evaluated before and after heating at 450°C, and the results showed the bond strength can be...
Conventional flip chip technologies such as the mass reflow (MR) process and the thermal compression bonding (TCB) process are commonly used technologies in the micro assembly field. However, there is a continuous need for next generation interconnection technology to achieve a low form factor with increasing die and substrate complexities. Moreover, very thin 3D integrated packages and 2.5D packages...
Power semiconductor devices and modules need highly efficient heat dissipation system having a chip bonding layer with high thermal conductance and reliability. Ag sintering chip-attachment has several advantages for heat dissipation. This work clarifies the thermal stress profiles under thermal cycling test by 3D multi-physics solver for double-side and single-side direct bonding structures with...
In system level electromigration test of 2.5D IC, Joule heating enhanced electromigration failure has been found to occur in redistribution layer in the interposer. In our test samples, there are two redistribution layers (RDL), each between every two levels of solder joints, so there are three levels of solder joints. First, the microbumps connect a Si chip on top and an interposer chip in the middle...
Increasing needs for functionality, performance and system miniaturization in fine-pitch consumer applications have been driving a new class of ultra-thin interposers and packages with larger body sizes, aggravating warpage. These trends gave rise to serious concerns for assembly yield and reliability, especially at board level. The recent adoption of substrate technologies with silicon-matching coefficient...
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