The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Through silicon via (TSV) technology has attracted much attention as a key method to realize chip stacking and interposers interconnected of 3D packaging. Due to the thermal load during fabrication and operation of TSV structure, the thermal stress will be produced owing to the structural material high CTE mismatch, which may lead to the failure of the TSV structure. In the case of uneven thermal...
The scope of this paper is to study on corrosion failure mechanism of ceramic optocoupler under thermal stress. With this regard, a failure case for current transfer ratio (CTR) deviates is analyzed. Scanning electron microscopy (SEM) and energy dispersive X-ray microanalysis (EDX) are used to detect the failure position. The SEM study revealed that the passivation layer is the critical factor of...
The solder points cracking of a component with package of ceramic ball grid array (CBGA) type is studied in the paper. The cracking cause is found and the failure mechanism is clarified. The weakness of the package structure design is demonstrated by comparing the experiment results of two kinds of components, which provides guidance for the reliable design and application.
This paper studies the impact of the accelerated thermal aging on the conducted emission produced by a synchronous buck converter. The most degraded devices mounted on the DC-DC converter are identified and modeled in order to simulate the evolution of conducted emission and anticipate risks of non-compliance to emission requirements.
In electrical power grids NH-fuse-links (gG) are widely used to protect electrical devices in case of overloads or shorts-circuit currents. New requirements of modern power grids, especially in the context of a growing share of renewable energies, implicate a much higher thermal stress level of the fuse-links. This can lead to an accelerated ageing of the fuse-elements, mainly due to the temperature-dependent...
Reliability prediction is widely used in industry for estimating field-reliability of a system before empirical data are available for the system. The two branches of reliability prediction, statistical based method and physics-of-failure based method are adopted in different industry sectors to make full use of their different merits. However, for power converters in electric drive system, the operation...
The traction current is returning to the supply source crossing the return circuit to the 25 kV single-phase AC power source. The return circuit consists of the running rails, which are connected by conductors to the joint coils terminals, and the return feeder to the traction substation. The connecting conductors (connection ropes) are subjected to thermal stresses due to the intense currents which...
The paper presents an impact analysis of the thermal stresses of electrical equipment impact on the environment temperature. To accomplish this were determined the steady-state overtemperatures and thermal time constants for three different sections of a busbar system, from a low voltage electric switchboard, in order to determine the thermal stresses for each case. To see how much the value of thermal...
High thermo-mechanical stresses are usually induced in through silicon via (TSV) structures due to the mismatch of coefficients of thermal expansion (CTE) between copper and silicon in Cu filled TSVs, which has brought an increasing concern for the reliability problems during fabrication process and operation of electronic devices. The size, shape and orientation of Cu grains in TSVs and their effects...
In this study, we report the reduction of via extrusion for Cu through-silicon vias (TSVs) through the application of a metallic cap layer. The basic idea of this approach is based on suppressing the mass transport which causes via extrusion on the top surface of TSVs. Two materials, W and Co, were deposited as the cap materials. Experiments were carried out to characterize the extrusion behavior...
Semiconductor power modules are widely used in the electric power conversion applications. The reliability of semiconductor power modules is one of the critical concerns for power converter design, operation, and lifetime estimation. This paper reviews the power cycle driven fatiguing causes, aging process, the failure modes of semiconductor power modules. Function components in a semiconductor power...
Molded underfill (MUF) is one of the most effective molding technologies in the advanced packaging industry. Developing highly reliable MUF is still challenging due to all basic requisitions of semiconductor packaging. Among all these requirements, controlling interfacial delamination between materials in integrated circuits (IC) packages has been considered to be the most important challenge to be...
Polymer film is general used for stress buffer and dielectric film for Wafer Level Chip Scale Package (WLCSP). Chemical resistance and mechanical resistance of polymer films usually get worse after several processes with chemicals or heat. Weak chemical or mechanical resistance will induce polymer film cracking. Polymer cracking further induces humidity penetration into RDL (Re-distribution Layer)...
Reliability analysis is performed for various redistribution layer (RDL) interconnect patterns. Five different RDL patterns are designed to examine die pitch, line length, line width, dummy block, and die edge/corner effects on RDL reliability. Temperature dependent material properties, grain growth induced stress, thermal mismatch stress, and plastic deformation evolution are taken into consideration...
This paper reports an amorphous CoTix alloy as a single-layer liner/barrier material for intermediate interconnects in place of bilayer Ta/TaN materials. The CoTix layer was found to enhance adhesion of Cu/SiO2. The CoTix layer stayed amorphous after annealing at 400°C, and started to crystallize at 500°C. Capacitance-voltage measurement of the samples showed no interdiffusion of Cu ions into SiO2...
Residual mutual coupling between the transmitter and receiver coil(s) is a well-known problem in frequency-domain (FD) electromagnetic induction (EMI) sensors. In cases where a ratio of the measured signal to primary field coupling signal is sufficiently high, careful geometrical arrangements of coils, such as those used in EMI gradiometers, are normally sufficient for suppressing the primary field...
During long-term operation of safety cables, it can happen quite easily that standard operation conditions are not fulfilled. This paper deals with the thermal shock and its impact on electrical parameters and sustainability of quality of coaxial cables. The aim of this paper is to compare thermo-chemical properties (measured by DSC) of dielectric material of tested coaxial cable and electrical measurement...
In this study, a low temperature solid state diffusion bonding process with (111) highly oriented nano-twined Cu (nt-Cu) was proposed. A less void bonding interface was observed reveals a good bonding quality for the bonded samples. In addition, a large quasi-single grain was identified in the bondedfilm. Based on these results, it is believed that high strength and durable bonding structure can be...
This paper presents an approach to reduce the temperature sensitivity of an anodic bonded resonant pressure micro sensor by attaching a quartz wafer to the backside of the sensor. The quartz wafer with a negligible expansion coefficient can effectively reduce the residual thermal stress in the sensor chip caused by anodic bonding. The silicon-quartz bonding based on hydroxide catalysis was proposed,...
A tungsten-rhenium thin film thermocouples is designed and fabricated, and the characteristics of thin film thermocouples in different temperatures are investigated via numerical analysis and analog simulation. Protective film was presented to prevent from the oxidation and evaporation of tungsten-rhenium TFTCs at high temperature. The experiment shows TFTCs sensor with protective film have an acceptable...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.