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This paper presents a crosstalk model base on even-odd mode analysis. It demonstrates that crosstalk analysis needs to look at the aspect of the timing delay between even and odd mode and the multiple reflections that occurred in a system. This concept is validated further by measurement result.
Abstract-Advancements in VLSI technology has made it possible to have more than eight metal layers connecting millions of closely placed devices in a single IC chip. Different interconnect layers run across the chip and the necessary connections across the layers are made through vias. The impedance discontinuity at the junction of the via and the interconnect line creates signal reflections and contributes...
Increase in processor speeds and recent advancements in processor performance through developments such as multi-core processing and simultaneous multi-threading (SMT) have resulted in a need for faster processor interconnect technology. The Intel® QuickPath Interconnect (QPI) is a high-speed, packetized, point-to-point interconnect used in Intel's next generation of microprocessors. Compared to its...
The manufacturing of interconnects often leads to conductors with a non-rectangular cross-section. Especially for sharp edges, it is therefore important to study the influence of corner effects on the interconnect circuit characteristics. Firstly, the electromagnetic behavior of a finite conducting 2-D wedge is investigated. Secondly, as an application example, a broadband transmission line model...
In this paper, the differential- and common-mode characteristics of coupled interconnect transmission lines are presented using four-port scattering parameter (S-parameter) measurements for a section of coupled line, a series resistor and a shunt resistor, where the impedances of the resistors need not to know. Firstly, the differential- and common-mode propagation constants are solved by the determining...
This paper investigates a low power, high speed & energy efficient current mode signaling technique. For current mode (CM) signaling a complete system consists of driver & receiver with decoding circuit. By analytical analysis it is also proved that the current mode signaling technique offer a three times improvement in performance parameter i.e. delays when compared to voltage mode. A new...
Differential interconnect lines in multi-gigabits system in package (SiP) packaging system are studied in this paper. The performance of interconnect lines can be easily estimated with jitter and eye opening using the eye diagram that is very helpful metric. To maintain good eye-diagram with high voltage swing and low timing jitter, a signal integrity (SI) design flow of SiP is proposed based on eye-diagram...
With the rapid development of high-speed digital circuits and high-integration-chip technology, more high-speed signals need to be transferred in high-speed interconnection. However, high-speed signals will experience delay, reflection, attenuation and crosstalk during the transferring. The transmission characteristic of printed circuit board (PCB) is very important as PCB is the support for the whole...
In this article a new method of nonuniform transmission line (NUTL) simulation is proposed. The method is patterned on asymptotic waveform evaluation (AWE). In this paper, the q-pole model is matched to imitate exact position of zeros and poles and values of residues of the poles of admittance matrix of the NUTL. The paper proposes to extend the lossless linear varied transmission line model by elements...
Microwave interconnect configurations composed of single wall carbon nanotubes (CNTs) are studied in this paper. Specifically, an atomic layer deposition (ALD) enabled nano-coaxial line with individual CNTs comprising the inner conductor, CNT Goubau line with ALD enabled alumina coating, a nano-coaxial line with inner conductor composed of CNT bundles, and Goubau lines of CNT bundles are discussed...
In this paper, we study multichannel pseudo-differential transmission schemes which use a common conductor or a return conductor. Combining 4 architectures with compatible types of termination circuit, we find that 12 multichannel pseudo-differential transmission schemes are possible. They provide a reduced external crosstalk compared to multiple single-ended links, using fewer conductors than multiple...
Return-path discontinuity (RPD) has a huge impact on the performance of interconnects carrying high-speed signals for Gb/s applications. In this contribution, we quantify the effects of RPD on both planar and vertical interconnects. For planar interconnects, we focus on the impact of slits on reference planes of embedded microstrip lines in thin-film re-distribution layers, considering the lossy nature...
Compact modeling and design of spiral inductors and interconnects in RF/mm-wave circuits require accurate yet efficient computation of their impedances. Till date, this task relies on electromagnetic (EM) field solvers with computational expense that does not scale beyond a few individual circuit components. This paper introduces an approach to compute impedances of interconnects and multiple inductors...
This paper presents the first accurate AC impedance extraction methodology for the evaluation of high-frequency behavior of graphene nanoribbon (GNR) structures targeted for interconnect and inductor applications. To overcome the simplifying assumptions of Ohm's law that is invalid for high-frequency analysis of GNRs and to take into account the electric field variation within a mean free path, the...
A fast LU factorization of linear complexity is developed to directly solve a dense system of linear equations for the interconnect extraction of any arbitrary shaped 3-D structure embedded in inhomogeneous materials. The proposed solver successfully factorizes dense matrices that involve more than one million unknowns in fast CPU run time and modest memory consumption. Comparisons with state-of-the-art...
The paper presents the scattering parameters analysis of the vertical Interconnected vias in microwave multilayer circuits. The vertical Interconnected vias can be divided into two parts which are known as the exterior structure and the interior structure and whose scattering parameters can be analyzed separately by the matrix-penciled moment method (MP-MOM)and the equivalent impedance method in parallel...
Simple uniform reduced order model is used to model an RLC interconnect line. Few number of sections are shown to achieve high accuracy of modeling the RLC interconnect. Waveform characterization is used to evaluate the accuracy of the adopted model. As compared to RC lines, five times the number of sections is sufficient to model RLC lines. The model is shown to be accurate for wide range of relative...
Signal path transitions through parallel reference plane structures on printed-circuit boards are investigated. The analysis is based on an equivalent circuit including the interconnect inductances, the signal source and load impedance. All required network elements can be calculated by simple formulas, including simple closed-form expressions for the self and mutual inductances in the central board...
This paper deals with a rigorous study of the impact by perpendicular metal grids on the characteristics of microstrip and coplanar coupled transmission lines. An electromagnetic analysis shows the variations of the propagation parameters in common and differential modes for each type of lines, in the presence of a metal grid. As transmission zeroes are liable to occur at certain frequencies, in particular...
Islanding detection is an essential function for safety and reliability in grid-connected distributed generation (DG) systems. Several methods for islanding detection are proposed in literature, but most of them may fail in multi-source configurations, or they may produce important power quality degradation when the DG penetration is high. This paper presents theoretical analysis and evaluation of...
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