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Today's technology is tuned towards faster, smaller and better efficiency. This trend has resulted in tremendous heat being generated in microelectronics components and if not properly managed, it can result in failure of microelectronics components. A critical issue is the removal of this heat generated. We report here a new type of nano thermal interface material (Nano-TIM) using the electrospinning...
In the paper, PEEK(poly(ether ether ketone)) was added to the epoxy resins as a modifier to improve thermal and mechanical properties of the cured resins. The heat effects of curing epoxy resin composites with PEEK were investigated by differential scanning calorimetry (DSC) technology and the morphologies of the fracture surface by scanning electron microscope (SEM). The relationship between the...
To improve mean-life and reliability of power cable, we have investigated specific heat and thermal conductivity of XLPE insulator and semiconducting materials in 154 kV XLPE cable. Specimens were respectively made of sheet form with EVA, EEA and EBA with carbon black 30 wt%, and the other was made of sheet form by cutting XLPE insulator in certain 154 kV power cable. Specific heat and thermal conductivity...
In this paper, we experimented the glowing and heating phenomenon at the contacts of copper wires, and studied the breeding process, the growing characteristics of copper oxide according to the diameter of copper wires and AC current. The surface structure, crystalline structure, compositions and calory variation of Cu2O that grew at the contacts of two copper wires were analyzed by using scanning...
The syntheses and thermal modulation of ternary single source precursors, based on the [{LR}/sub 2/M/sup 1/(SR')/sub 2/In(SR')/sub 2/] architecture in good yields are described. Thermogravimetric analyses (TGA) and Low temperature Differential Scanning Caloriometry, (DSC) demonstrate that controlled manipulation of the steric and electronic properties of either the group five-donor and/or chalcogenide...
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