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This paper presents the characterization and modeling of inkjet printed interconnects on flexible polyimide substrate using nano-particle silver ink for low-cost RFID applications. Then TDR/TDT and S-parameter measurements are performed at high frequency from 30 kHz to 6 GHz. A lumped equivalent circuit and distributed parameter model of the printed interconnects have been developed for the realization...
Designers require variational information for robust designs. Characterization of such information can be costly for the novel nanoparticle interconnect process, which utilize nanoparticle silver solutions. To reduce characterization cost and initiate circuit level considerations for foldable electronics, we provide nanoparticle interconnect models. We use SEM measurements to characterize nanoparticle...
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