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Reliability analysis is performed for various redistribution layer (RDL) interconnect patterns. Five different RDL patterns are designed to examine die pitch, line length, line width, dummy block, and die edge/corner effects on RDL reliability. Temperature dependent material properties, grain growth induced stress, thermal mismatch stress, and plastic deformation evolution are taken into consideration...
This paper reports direct in-situ stress measurements with microscale spatial resolution in glass using Raman spectroscopy. This new technique is used to assess the reliability of copper-plated laser-drilled through package vias (TPV) in ultra-thin bare glass interposers. Bare glass panels of 3"x3" size, with 137µm and 237µm thicknesses were fabricated with laser-drilled through-package...
Silicon interposers with through-silicon vias (TSVs) have been developed in single-crystalline silicon wafer to address the high I/O density requirements between high performance logic, memory, graphic, and other devices. However, single-crystalline silicon interposers suffer from many shortcomings such as high cost, low electrical performance, and reliability. To overcome these shortcomings of traditional...
Thin film polymers play an essential role in system integration. The mechanical properties of the polymers are crucial for 3-D-Integration and advanced WLP because with the thinning of the silicon wafers, i.e. chips to less than 150 μm, the influence of the polymer layers gets an increasing impact on the mechanical stability of the electronic device. Next generation polymers have entered the market...
This paper presents a reliability study on a 15×15mm2 silicon interposer packages, 5 times larger surface than usual studies on wafer level chip scale package (WLCSP). Works were conducted in the frame of silicon platform developments for heterogeneous RF 3D modules, where the interconnections number is lower than in digital applications but the silicon interposer larger than conventional WLCSP. Several...
This paper describes the thermo-mechanical design of an advanced zero-level capping technology used for packaging of a MEMS die. The package approach uses Intermetallic Compound (IMC) bonding to seal the MEMS die with a cap, and uses Through Silicon Via's (TSV) to provide the electrical connections from the MEMS die to the second level substrate (LTCC or PCB). Advanced FEM based thermo-mechanical...
In this paper, the state-of-the-art results of research and development in wafer-level packaging (WLP) is reviewed. The paper starts from the introduction of several fan-in wafer-level packaging technologies. The focus is given on the fan-in WLP reliability performance as related to the structural differences. New failure mechanisms that appear in build-up stack layers are discussed. Next, emerging...
Although plastic packaging has successfully replaced ceramic and metal packages for many high reliability electronic packaging applications (e.g. military and aerospace), hermetically sealed ceramic packages are still the dominant technology for large power devices, such as the thyristors and diodes used in high voltage DC (HVDC) power transmission. With increasing energy requirements of growing economies,...
With the development trend of microelectronic system with small size, high speed, high frequency and high density, passive and active components are directly embedded into a core or high-density-interconnect layers. This System-in-Package (SiP) technology could shorten interconnection between the die and substrate and reduce the inductance and noise interference. However, there are many electrical...
Due to large mismatch in coefficients of thermal expansion between the copper via and the silicon of Through Silicon Via(TSV), significant thermal stresses will be induced at the interfaces of copper/dielectric layer (usually SiO2) and dielectric layer/silicon when TSV structure is subjected to subsequent temperature loadings, which would influence the reliability and the electrical performance of...
Wafer Level Packaging (WLP) has the highest potential for future single chip packages because the WLP is intrinsically a chip size package. The package is completed directly on the wafer then singulated by dicing for the assembly. All packaging and testing operations of the dice are replaced by whole wafer fabrication and wafer level testing. Therefore, it becomes more cost-effective with decreasing...
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