The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this work, we were interested about the study of modeling and simulation of a structure based on In1−xGaxN/GaN for photovoltaic applications. This ternary alloy who is an III-V semiconductor presents important characteristics especially its bandgap energy, thus the enhancement of the absorption of photons with wavelengths near to red. We had also studied a different parameters characterized the...
The method of the split cylinder resonator cavity (SCR) is used to characterize accurately and simultaneously in one temperature cycle, dimensional and electrical characteristics of the cavity and the electromagnetic properties of a dielectric material. To do this several modes are used, some to control the cavity and others to control the sample.
In this study, varying amounts of Ni-CNTs were incorporated into the Sn-Ag-Cu matrix to form the composite solders. The interfacial intermetallic thickness formed on the Ni/Au metallized Cu substrate was determined under the as-soldered and isothermally aged (at 150°C for up to 42 days) conditions. The results of the interfacial intermetallic thickness showed that for the case of the unreinforced...
We reported high-speed transport properties on gallium nitride (GaN) single nanowire (NW) transistors laterally grown on the (0001) sapphire substrates. Due to the preservation of surface stoichiometry and passivation effects by the facet growth of [112̅0]Ga2O3/GaN, the 60nm-dia. SNW-MOSFET device of 0.2μm gate length was shown to exhibit a saturation current of 145μA, current on/off ratio of 105,...
New applications such as the use of High Brightness Light Emitting Diodes (HB-LED's) for general lighting have brought about significant demand for thin dielectric materials laminated to metal substrates such as aluminum and copper. Conventional FR-4 printed wiring laminates have limited thermal performance due to the poor thermal conductivity. To maximize thermal performance, it is necessary to minimize...
As electronic devices become lighter, thinner, shorter, and smaller, IC packages follow. Low-profile type packages are reduced in thickness, so the stiffness of thin type packages is weaker due to the thermo-mechanical effects of manufacturing processes, testing, and operations. Due to the different temperatures in those processes, and the differences in coefficient thermal expansion (CTE) of each...
This work shows the effect of the conductor surface roughness (CSR) in the measurement of the loss tangent using the microstrip ring resonator method (RRM) in three low-loss, organic dielectric substrates (RT/duroid 6002, 6202 and 5880) and each, with two types of copper metallization. In addition, relative permittivity and loss tangent measurements are presented from 30 GHz to 70 GHz for the three...
The article deals with the influence of surface roughness on solderability. The area of spread test was used as a method for solderability measurement. For this measurement, test samples made from substrates for printed circuit boards, small solder balls, and two soldering technologies - vapor-phase and reflow soldering - were used. These technologies have been used because of similarity with the...
It is becoming increasingly common to use magnetic substrates in antenna devices. A model of effective permeability is showed in order to analyse the behaviour of magnetic multilayer. From this model, we can see the negative effect of the conductivity to the effective permeability of a multilayer magnetic substrate.
To satisfy the requirements of the newest mobile product, smaller solder ball is needed for electronic packages such as chip scale package (CSP). The purpose of this study was to investigate the effect of solder ball size on the interfacial reaction. In this study, 400, 300, and, 200 ??m diameter solder balls of 98.5 wt.% Sn, 1 wt.% Ag, and 0.5 wt.% Cu(SAC105) were formed on the Cu/OSP and electroplated...
As microelectronic applications and technologies are getting more demanding, it is being demonstrated that the 3rd (vertical) dimension on wafer-processing technology is enabling applications and products with higher performance. Approaching the 3rd dimension in wafers is actually considered and realized through emerging TSV (through silicon via) technology and thinned wafers at the same time. Thin...
In recent years there have been several motivations away from thickness field excitation and toward lateral field excitation for thickness shear mode (TSM) fluid phase sensors. Lateral field excitation offers an unmetallized sensor surface for electrical interactions while still providing for hermetic packaging of the driven electrodes. Historical substrate selections have supported both thickness...
Flip chip packaging of ultra fine pitch integrated circuits (ICs) on organic substrates aggravates the stress-strain concerns, requiring a fundamentally different system approach to interconnections, underfill, interfaces, and the substrate. This work demonstrates a novel interconnection solution with excellent reliability for ultra-fine pitch (~30 mum) silicon (Si) on organic first level interconnections...
Effective antenna miniaturization is a challenging problem due to the inevitable trade-off between the size and the performance of the antenna due to the fact that antenna performance is bound with the fundamental limits based on the size of the antenna. Antenna miniaturization is also a critical issue since the key component determining the size of a mobile device is usually the antenna. Recent studies...
The electromigration of flip chip solder joints is an ongoing reliability concern for manufacturers of integrated circuit (IC) components and electronic systems. As power levels of ICs continue to increase, current densities within individual solder bumps often increase, along with the operation temperatures of the die surface. Both of these factors have detrimental impact on the electromigration...
In this paper we present an ultra-high wiring density build-up substrate targeted at 30 mum IC-to-substrate interconnect pitch, using a new low loss thin core laminate (RXP-1) and low dielectric constant and low loss thin build up dielectric (RXP-4). The RXP-1 core is a glass fiber reinforced organic laminate with a thickness in the range of 50-110 mum. The RXP-1 core has a stable dielectric constant...
This paper examines the use of nanocomposites in the area of ldquogreenrdquo technology. A variety of green materials for advanced organic packaging have been developed. These include capacitors and resistors as embedded passives, resin coated Cu (RCC) as buildup layers, highly conducting nano-micro media for Z-interconnects, lead free assembly paste, ZnO based additives and magnetic materials. Nanocomposites...
A finer interconnection pitch of LSI packages has enhanced the importance of precise prediction technology of temperature-dependent warpage. In our research, we prepared a model package with minute wiring and vias, and examined a method of improving the agreement accuracy between numerical analysis and measurement of temperature-dependent warpage. To improve the precision of warpage prediction technology,...
In this paper, the material characteristics of six epoxies used for corner/edge-bonding are analyzed and compared to board-level mechanical reliability test. An innovative material characterization approach, button shear testing, provided an expedient method of determining adhesive strength between the epoxies and each relevant surface material. The board-level test included mechanical shock test...
The current standard for flipchip encapsulation is a two step process. Following flipchip attach, a liquid underfill material is dispensed along the die edge and allowed to flow, via adhesive capillary force, through the gap between the flipchip die and the PCB. Upon cure of the liquid underfill, complete die encapsulation is achieved with a standard transfer mold process using preformed epoxy pellets...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.