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In this paper, we explore different implementation levels of RF power amplifiers, including a hybrid PCB approach and a system-in-package (SiP) approach based on low temperature co-fired ceramic (LTCC) technology. The selected device of the amplifier is a low cost Si based AlGaN/GaN high electron mobility transistor (HEMT). Measured results show that the LTCC-PA module can exhibit an output power...
AIGaN/GaN HEMT power MIMIC which is designed in microstrip technology on Sl-SiC substrate is presented in this work. The chip size is only 2.0 mmtimes1.1 mmtimes0.08 mm. The developed two-stage power MMIC operates at frequency between 9.4-10.6 GHz and delivers a pulsed output power of 11.1 W at 9.7 GHz under a drain bias of 30 V. The linear gain of the MMIC is about 10 dB which is much lower than...
Power amplifiers for a next generation of T/R-modules in future active array antennas are realized as monolithically integrated circuits on the bases of novel AlGaN/GaN HEMT structures. Both, driver and high power amplifiers are designed for X-band frequencies. The monolithically integrated circuits (MMICs) are designed, simulated and fabricated using a novel via-hole microstrip technology. Output...
A nonlinear large-signal table-based model of AlGaN/GaN HEMTs that able to predict output nonlinearities including intermodulation distortions (IMD) is described. The equivalent circuit model elements of the dispersive model are derived from S-parameter and pulsed DC I(V) measurements. With proper data processing and implementation, the speed and accuracy of simulations under multi-tone excitations...
We have successfully developed a 500W AlGaN/GaN HEMT power amplifier with a frequency of 1.5GHz in L-Band, operating at 65V drain bias voltage. This amplifier consists of 4-chips of HEMT die developed for L-band frequency operation with push-pull configuration. The developed amplifier has an output power of 500W and a high linear gain of 17.8dB at the frequency of 1.5GHz under pulsed conditions at...
In this paper the MMIC technology, design and characterization of a high power amplifier and driver amplifier MMIC at 30 GHz in AlGaN/GaN HEMT technology are presented. The MMICs are designed using CPW technology on a 390 /spl mu/m thick SiC substrate. The measured small-signal gain of the driver is 14 dB at 28.5 GHz and the measured output power is 28.6 dBm at 28 GHz. The power amplifier shows a...
Carbon nanotubes (CNTs) have been successfully developed as thermal and source bumps for flip-chip high power amplifiers (HPAs). The newly developed 15 mum long CNT bumps exhibit thermal conductivity of 1400 W/m-K. A flip-chip AlGaN/GaN HEMT HPA with a gate width of 2.4 mm utilizing CNT bumps, operating voltage of 40 V, exhibits an output power of 39 dBm at, a frequency of 2.1 GHz without any degradation...
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