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This paper studies a real-world signal Integrity problem due to switching voltage-regulator (VR) noise coupling in a multi-processor server system. The fast switching of the VR FETs causes significant performance degradation on signal lines in proximity. The major source of the degradation is the high di/dt noise induced by FETs switching. The coupling mechanism is mutual inductive coupling between...
In this paper, we have derived a closed form formula for the power dissipation in highly coupled distributed RLCG interconnects taking the mutual inductive coupling into account. Power is increasingly becoming the bottleneck for the design of high performance VLSI circuits. It is essential to analyze how the various components of power are likely to scale in the future, thereby identifying the key...
This paper addresses an important issue regarding power-transistor packages: The mutual inductive coupling of the bondwires. Based on em simulation and analytical parameter extraction, it is shown that the mutual inductances play a key role in determining the packaged transistor performance.
Single-turn spiral inductors with magnetic material to enhance inductance are fabricated. Using double-layered Permalloy dots above and below the inductor metal, inductance improves and remains constant beyond 10 GHz with a Q factor around 11 and a peak frequency around 9 GHz. By employing single-turn small-sized inductors, the self-resonance frequency of the inductors is shifted to very high frequencies...
This paper presents a design of on-chip voltage generator for applications in battery-less low voltage transceiver. The supply voltage for this on-chip voltage generator is obtained from mutual inductive coupling through radio frequency (RF) electromagnetic field which is able to generate 150 mV peak voltage. This on-chip voltage generator is used to generate a supply voltage for a low voltage low...
3D packaging is extensively used in digital applications, and is under consideration for analog RF applications as well. A key problem, however, is the coupling of strong output signals from front-end passive devices into the local oscillator of a transceiver chip. The main mechanism for this is mutual inductive coupling. In this study, a test structure has been designed, built and measured to examine...
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