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The higher stiffness of Pb-free SAC solders makes Pb-free assemblies more sensitive to drop impact. In order to be able to optimise the drop test performance, it is necessary to have better insight into the crack propagation in the Pb-free solder joints. This study combines on-line resistance measurements of a solder joint during drop testing and high speed bend testing, failure analysis of the assembly...
This paper describes a flip chip technology representing a technological breakthrough compared with conventional method such as soldering or the bonding through conductive adhesives. Electrical connections are performed by the insertion of metallic micro-tips in ductile solder material. As low temperature and fluxless technology, this method is adapted to fine pitch and large devices. Here we present...
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