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A new generation of thin-film thermopiles is presented with improved temperature stability due to the implementation of a diffusion barrier of titanium-nitride. Commonly thermocouples are made of aluminium and polysilicon or semi-metals materials as Sb, Te and Bi. Exposure to elevated temperature in the range of a few hundred degrees centigrade would affect the functionality of the devices and leads...
A Monte-Carlo simulation code SEALER was developed for neutron-induced single event upset of semiconductor devices at the ground level, in which composite material effects are fully simulated. Any size and structures of 8 composite material such as Si, SiO2, Si3N4, Ta2O5, WSi2, Cu, Al, TiN can be included for analyses of nuclear spallation reactions and charge collection mechanisms. Some preliminary...
A controllable method is described for the selective or nonselective growth of high-quality Al on Si(100), Si(111) and TiN versus SiO2 by low-pressure chemical vapor deposition (LPCVD) using a dimethylaluminum hydride (DMAH) source. The selectivity deposited Al on Si surface was confirmed to be single-crystal by microregion observation with a scanning μ-RHEED microscope. The authors produced...
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