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Ultra-fine pitch Au wire has become inevitable in the electronic packaging industry due to decreasing electronic package dimension and increasing cost of gold. However, fine pitch Au wire with diameter less than 0.5 mil. (12 ??m), bonded on Al pad, showed low inter-metallic coverage, and it caused distinctive interfacial failures: the oxidation of Au4Al and overgrowth of inter-metallic compound (IMC)...
A needle-plane electrode system was used to study the characteristics of the silicone rubber under AC corona. Microstructure and chemical structure change analysis on the surface of silicone rubber after corona ageing was made by using SEM, AFM and FTIR. Infrared spectrum shows that corona would cause the rupture of fundamental chain and branched chain of material. Along with the increase of corona...
Wire bonding is the most applied technology to realize an electric chip-to-package interconnection and to provide electrical paths from and to the substrate for power and signal distribution. Established in the 1970s, wire bonding has been well documented and researched as a result of continuous process improvement and through the development of sophisticated, automated equipment over the years, [1-2].
The thermal stability of flip chip solder joints made with Al/Ni(V)/Cu-UBM and SAC-405 solder bumps on substrates with either electroless Ni(P)-immersion gold (ENIG) or Cu surface finish (Cu-SOP) was determined at 170C. On ENIG, the resistance changed by more than one order of magnitude after 400 hours of high temperature storage, whereas on Cu-SOP, no change in resistance was observed up to 2400...
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