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The shape memory effect for TiNi to improve by using strain in the thin film deposited on a buffer layer (Nb, Mo, Ta, and W) has been investigated. First of all, the contact points on each surface between TiNi thin film and buffer layers (where the contact point is defined as atomic position difference for bonding between each atom on lattice axis in both surface of thin film and buffer layer) were...
SnCu2-4Ni1-2 as a lead-free solder was prepared from both sulfate and chloride plating solutions by galvanostatic electrodeposition. Current-potential polarizations for both plating baths were obtained with their respective deposition rates measured. Characterizations including SEM, EDX, and XRD were carried out to obtain relevant materials properties.
DLC and metal/DLC nanocomposites coatings deposited by means of pulsed laser deposition /PLD/ technique, using high power UV nitrogen laser are described. The DLC and M/DLC nanocomposite coatings are deposited on substrates stents made from 316L SS material and NITINOL (NiTi) alloy. The tests and analysis of the morphology-, structure-, physical-, mechanical- electrochemical- and chemical parameters...
As lead free solders are being implemented in commercial electronic goods, reliability of electroless Ni(P)/Pb-free solder joint has become an important issue because formation of Ni3P and Ni3SnP at solder/UBM interface increased the susceptibility to brittle cracking through these layers. In this report, composition of electroless Ni(P) under bump metallization(UBM) was modified by co-depositing...
Slot die coating and conversion of La2Zr2O7(LZO) buffer layers were performed on rolling assisted biaxially textured Ni-W with and without thin Y2O3 seed layers. The slot die coating, drying and processing were all performed using reel to-reel systems. The slot die coated LZO precursor films were then reacted under a variety of conditions and the texture and morphology development were characterized...
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