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SnCu2-4Ni1-2 as a lead-free solder was prepared from both sulfate and chloride plating solutions by galvanostatic electrodeposition. Current-potential polarizations for both plating baths were obtained with their respective deposition rates measured. Characterizations including SEM, EDX, and XRD were carried out to obtain relevant materials properties.
As lead free solders are being implemented in commercial electronic goods, reliability of electroless Ni(P)/Pb-free solder joint has become an important issue because formation of Ni3P and Ni3SnP at solder/UBM interface increased the susceptibility to brittle cracking through these layers. In this report, composition of electroless Ni(P) under bump metallization(UBM) was modified by co-depositing...
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