The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper presents the design, fabrication, and characterization of temperature sensitive quartz resonators fabricated using heterogeneous integration methods for realizing high-density, thermal conductance fluctuation limited thermal sensors for infrared imaging and biochemical sensing applications. An integrated quartz sensor array using CMOS-compatible micromachining techniques has been designed...
This paper describes the design of a silicon chip that integrates multiple sensors together to monitor a variety of fluid quality parameters. The MEMS universal fluid quality interrogation sensor (MUFINS) eliminates the need to design a new chip for every fluid that requires quality control. The MUFINS chip is capable of measuring temperature, viscosity, liquid level, humidity, conductivity, pH, chlorine,...
Wire bond reliability testing typically consists of aging bonds in a high temperature environment for long time periods, removing samples at intervals to assess bond shear strength and characterize the bond cross sections. In this way, the degradation of the bond can be monitored at discrete time intervals, and it is determined whether the bond will be reliable under long term operation at lower temperatures...
This paper presents a battery-less tire pressure monitoring system. Electro-magnetic field energy harvesting is utilized. The chip is also capable of RFID in a frequency range from 1MHz to 2.45GHz. The sensor data is transmitted either by an active transmitter at 868MHz or by employing the RFID feature. A bulk acoustic wave resonator is used as frequency reference for the active transmitter. An external...
We present a dual axis accelerometer made with a frontside bulk micromachining on a 0.35 μm CMOS. The accelerometer is based on thermal convection where a central heater creates a hot gas bubble. Acceleration applied to the body will change the temperature distribution on the device, the latter being measured by four detectors containing six serially connected thermocouples. The paper will present...
This study demonstrates a novel monolithic TPMS (tire pressure monitoring systems) using CMOS MEMS processes. This TPMS monolithic integrates the 3-axis capacitive accelerometer, capacitive pressure sensor, and platinum (Pt) thermal-resist temperature sensor on a single chip. The TPMS has been successfully implemented using TSMC 2P4M process and our in-house post-process. The footprint of TPMS chip...
In this paper, a monolithic integrated piezoresistive flow sensor is presented, which was fabricated with an intermediate CMOS MEMS process compatible with pressure sensors. Four symmetrically arranged silicon diaphragms with piezoresistors on them are used to sense the drag force induced by the input gas flow. Signal conditioning CMOS circuit with temperature compensation was designed and tested,...
This paper reports the thermal characterization of MEMS resonator-based oscillators fabricated using a conventional 0.35-mum CMOS process. The MEMS resonators are sub-micrometer scale metal beams which resonance frequency is highly dependent on temperature (up to -2055 ppm/degC). Thanks to the monolithic integration of the oscillator electronics, the oscillator frequency stability is better than 1...
This work presents the design and characterization of a CMOS-integrated thermal sensor that features a novel oscillator-based sensing interface to achieve a high thermoelectric sensitivity. The thirty pairs of thermocouples are made of n+/p+ polysilicon of a standard 0.18-mum CMOS to produce a large thermoelectric voltage. The produced thermoelectric voltage is used to control the bias current of...
This paper presents a complete gas-sensing chip. It consists of a high-efficiency temperature control loop with a switching power stage and digital set-point and of a wide-dynamic-range interface circuit able to operate without calibration. Measurements results show that the controlled temperature of the sensor over a range of 250degC exhibits an accuracy better than 1.5degC with a maximum peak-to-peak...
A compact converter from capacitance to pulse width, suitable for interfacing integrated capacitive sensors is described. The circuit has been designed and fabricated using 0.32 mum/ 3.3 V CMOS devices from the BCD6s process of STMicroelectroncs and occupies an area of 1025 times 515 mum2. Measurements performed on the test chip showed an excellent linearity, a temperature drift of 300 ppm/degC, and...
This paper presents the characterization of a novel event-based 64 times 64 pixel temporal contrast IR sensor. The device consists of a micro-bolometer thermistor array and a CMOS readout IC employing asynchronous, spiking pixel circuits. The pixels independently respond to changes in thermal IR radiation and communicate detected variations in the form of asynchronous ldquoaddress-eventsrdquo (AER)...
The aim of a joint research and development project at the BME and HWU is to produce a cheap, reliable, low-power and CMOS-MEMS process compatible capacitive type relative humidity (RH) sensor that can be incorporated into a state-of-the-art, wireless sensor network. In this paper we discuss the preparation of our new capacitive structure based on post-CMOS MEMS processes and the methods which were...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.