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The development of high power and compact size semiconductor packages lead to the challenge in the need of high thermal dissipation design. For package level thermal solution, metal (especially copper) heat spreader and metal/metal-oxide filler thermal interface material are widely adopted. However, the thermal performance of packages is limited by isotropic conductive behavior of most of these materials...
In-situ junction-to-case thermal resistance (Theta JC) measurements are sensitive to a number of test condition factors. In this paper, the effect of electronic package die temperature on junction-to-case thermal measurements is reported over a nominal use condition temperature range of 40 to 105°C. Multiple parts were tested under a variety of boundary conditions to assess the impact of die temperature,...
One of the major bottlenecks for the advancement in electronics is their heat dissipation. The exponential increase in packing density and computational power have resulted in a significant increase in power consumption and heat generation, such that thermal management in the new generation of microprocessor (i.e. 2.5D and 3D electronics) is starting to pose challenges in future development. These...
This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator...
Thermal tools provide temperature margining capability by varying the case temperature at silicon thermal design power (TDP). They are used for process, voltage, temperature and frequency (PVTF) testing by Intel's post-silicon validation customers across servers, desktops, mobile and graphics segments. Thermal margining tools are widely used in silicon debug validation by varying the case temperature...
The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path...
This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (−50°C/+150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator...
Thermal interface materials (TIMs) are widely used as heat conductive medium between a heat source and a heat dissipating device. A high thermal performance TIM can provide a low thermal resistance path and thus improve the thermal management of the heat source. This paper presents various criteria for TIMs used in silicon validation environment in addition to the well-known criteria for high performance...
The ongoing need for miniaturization and speed in electronics industry has brought a requirement for better performing thermal management systems. One of the major bottlenecks in thermal management is the thermal interface resistance. Characterisation of thermal interface materials become even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials...
In this paper the aspects of thermal interface material characterization are discussed from a practical point of view. A novel method based on existing measurement standards is introduced for a quick and repeatable thermal conductivity measurement of nanoparticle-based thermal greases. The effect of the surface roughness of the DUT fixture is evaluated, as well as a method is introduced for the long...
HFCBGA is a thermally enhanced FCBGA with its heat spreader extending heat conduction area by connecting itself to the rear side of the silicon die. A thermal interface material plays an important role as a heat conduction path. The thermal performance should be checked not only at time zero, several types of reliability tests have to be examined to cover the field condition faced by end user. Temperature...
As the demand for new thermal technologies and materials has been increasing over the years to provide thermal solutions to the next generation of power electronics, microprocessors and high-power optical systems also thermal characterisation methods have to keep up with the pace of this development with respect to resolution and accuracy. Within the EU-funded project ldquoNanopackrdquo we have developed...
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