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NEMI recommended Sn3.9Ag0.6Cu to replace the eutectic SnPb solder, but solder joints of this alloy have poor performance in reliability tests of electronic packages, especially the board level drop test. In this paper, the effect of Cu content in solder is studied on the interfacial reliability of SnAgCu solder joints on the Ni/Au plated pads. After preconditioning (three reflows post package assembly),...
Joint strength between solder ball and pad on the substrate is one of the major factors which have effects on the electronic device reliability. To improve the strength of the solder joint, the efforts evaluation surface cleaning, heat treatment and change of solder composition have been in progress. This paper discussed a solder ball joint strength improvement using low frequency hydrogen radical...
This study utilized out high speed lap-shear tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150??C and 170??C) were also tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the lap-shear...
The work presented in this paper focuses on the role of 3 wt.% Bi in the base Sn-9%Zn solder on the shear strengths and the interfacial reactions with Au/Ni/Cu pad metallization in ball grid array (BGA) applications. Sn-Zn based Pb-free solder alloys were kept in molten condition (240degC) on the Au/electrolytic Ni/Cu bond pads for different time periods ranging from 1 minute to 60 minutes. Cross-sectional...
In this work, Ag micro-particles content in the range between 0-4.0 wt.% with Sn-Zn eutectic system, were examined in order to understand the effect of Ag addition on the microstructural and mechanical properties as well as the thermal behavior of the composite solders. The shear strengths and the interfacial reactions of Sn-Zn micro-composite eutectic solders with Au/Ni/Cu ball grid array (BGA) pad...
Ball impact test and ball shear test have been used to investigate the joint strength. The joint strength of lead and lead-free solder joints under high strain rate condition were examined. Microstructure in the as-reflowed condition and fracture surfaces were investigated. The intermetallic compounds of Sn-3Ag-0.5Cu joints demonstrated as layer-type (Cu, Ni)6Sn5. Fractographies show that all of Sn37Pb...
In this investigation, normal and high speed ball shear test were used to evaluate the solder joint performance. Solder residual fracture mode is always being found in normal ball shear for low strain rate. The strength of solder balls are directly associated with their mechanical property in normal ball shear test. High speed ball shear provide a easier way to judge the solder joint performance at...
The solder balls on the plastic ball grid array (PBGA) packages provide both electrical input/output and mechanical supports. Mechanical properties and strengths of solder balls significantly influence the PBGA package reliability. Temperature cycling test has been widely used in flip-chip technology (FCT) in order to simulate the failure mode due to fatigue and aging under repeatedly heat treatment...
In this study, Sn3.0Ag0.5Cu solder bump was jointed on Ni(V)/Cu UBM and then aged at 125 degC for 500-2000 h. The heat treatment samples were employed to investigate the interfacial reaction and the mechanical properties between solder and UBM. (Cu,Ni)6Sn5 IMC formed at the interface between solder and Ni(V) layer after assembly. The thickness of (Cu,Ni)6Sn5 gradually increased to 4 mum during aging...
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