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The amorphous electroless NiP film is used as under-bump metallization (UBM) structure of chip pad or surface finish of IC substrate (or printed circuit board) to join with different solders on microelectronics package due to low cost process, low IMC growth rate, and good solder wetting behavior. However, Au film usually induced some problems on Au/NiP films, including Au corrosion, black pad issue...
In the present study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix, to form a composite solder. The interfacial intermetallic compound layer thickness formed on electroless nickel immersion gold (ENIG) metallized Cu substrate was determined under the as-soldered condition. It was observed that the addition of 0.01 wt.% Ni-CNTs into the Sn-Ag-Cu solder matrix, affected...
Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases...
The purpose of this study is to investigate the mechanical behavior of Sn-Ag-Cu solder joint under high speed shear test. A impact testing method with shear rate up to 1.0 m/s was set up to measure the solder joint reliability. The effects of differential substrate pad opening and pad metallization were also considered. The study focuses on failure mode analysis and examines characterizing strengths...
This study investigate the interfacial reactions and mechanical property between Sn-4.0Ag-0.5Cu (SAC, in wt%) and Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG, in wt%) lead free solders with Au/Ni(P)/Cu substrate by CO2 laser reflow. These results compare with the same systems under a conventional hot-air reflowing method in the oven. After reflowing, all samples were then taken heat-treatment at 150??C for...
This study evaluated room temperature creep properties of the intermetallic compounds (IMCs) formed at the interfaces between Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the commonly used electronic substrates (Cu, Ni and Ag) using nanoindentation. The creep stress exponent (CSE), representing creep resistance, in the decreasing order was Cu, Ni and then Ag based IMCs, which was in good agreement with...
It is gradually recognized that Sn-Ag-Cu is better alloy system for application prospect in the lead-free solders. In order to cut down the cost and improve properties, researchers have always been searching for proper compositions and adding elements to improve properties actively. This paper has investigated the effect of Ni addition on Sn-0.3Ag-0.7Cu (SAC0307) low-Ag solder joint. The results of...
In this work, electrodeposited Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt's bath. Ni-W alloy films of about 1.5 to 2.5 mum were deposited from ammonia-citrate bath on copper...
Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu (SAC) alloys. The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC, such as the poor mechanical...
The impact toughness evaluation and fracture mechanism analysis in board level of Sn-3 mass%Ag-0.5 mass%Cu solder joints of ball grid arrays (BGAs) using electrolysis Ni/Au plating were performed. The cause of impact toughness degradation of BGA solder ball joints is the segregation of impurities to the (Cu, Ni)6Sn5 intermetallic compound grain boundary formed in the solder joints. The impurities,...
Cu/electroless Ni/immersion Au metallization is usually used as bonding pad on the substrate side of flip chip solder joints. Sn-Ag-Cu solder is one of the promising candidates to replace the conventional Sn-Pb solder. Isothermal interfacial reaction in Sn-3.0Ag-(0.5 or 1.5)Cu solder joints with electroless Ni/immersion Au surface finish after aging at 150degC was investigated in this study. Intermetallic...
Isothermal three-point and four-point cyclic bend fatigue test method have been developed for Sn-Ag-Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25degC) and there is lack of data for lead-free solder joints. In this study, VQFN assembly with Sn-Ag-Cu lead-free solder was tested under three-point and four-point cyclic bending load at room temperature...
In this study, VQFN (very thin quad flat no lead) assembly with Sn-Ag-Cu lead-free solder and Ni/Au board finish was tested under three-point and four-point cyclic bend at room temperature (25degC) and high temperature (125degC). Correlation between three-point and four-point bend was performed. It was found that the cycle to failure increases significantly with displacement ranges decreasing for...
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