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Electroplating is a low cost process where metal ionsin a solution are reduced by an applied electric field onto aconductive substrate. This process has been studied extensively, but is still critical for modern technology and R&D. In the HPinkjet printing business, electroplating is primarily used in themanufacturing the orifice plate (OP) for integrated print-headproducts. To extend the OP functionality,...
This paper proposes an accelerometer based on metal-oxide-semiconductor field effect transistor (MOSFET), the gate electrode of which is movable because it is suspended by a flexible Parylene beam. When acceleration is applied, the gate is moved due to inertia force, making the change in drain current. It is notable that any external amplifying circuitry is not required, since the device itself acts...
This report describes our work on microfabricated containers that store small amounts of environmental samples for analysis. The containers are based on “strain architecture,” a fabrication technique which causes planar microstructures to fold out of plane from the substrate. These structures remain connected to electrodes for thermal actuation, electrochemical sample collection, and gas generation...
Reliable structures and systems are critical for numerous engineering applications, e.g. manufacturing, energy conversion, and biomedical implants. These systems generally operate in harsh environments. Effective monitoring and diagnosis of these structures or the harsh environments where these structures are operating is of critical importance. Significant development of micro/nano-systems technology...
The 3D interconnection started at 3D PLUS in 1996 and led to the stacking of nearly all types of analogical and logical components, sensors, MEMS, etc... for the Hi-Rel field (space, defence, medical, industrial). A stacking technique of all types of bare dice has been developed. The various manufacturing steps as well as the main applications will be presented. This technology is extremely robust...
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