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In present work curing kinetics of UV-initiated cationic photo-polymerization of EPICLON series epoxy resin HP-820 and key cure process parameters, such as the extent of cross-linking and conversion, polymerization rate and the order of reactions have been studied by Photo-Differential Scanning Calorimetry (DPC). Different kinetics analysis results, including enthalpy of the reaction, induction time,...
Experiments were conducted to measure the ac breakdown strength of 0.5 mm, thick epoxy alumina nanocomposites with different filler concentrations of 0.1, 1 and 5wt%. The experiments were performed as per the ASTM D 149 standard. It was observed that the ac breakdown strength was marginally lower up to 1wt% filler concentration and then increased at 5wt% filler concentration as compared to the unfilled...
In this research, epoxy resin was modified by amine-terminated polyimide (ATPI) prepolymer for improving both thermal and mechanical properties of electronic packaging materials. The ATPI was synthesized with polyester and pyromellitic dianhydride (PMDA), p-toluene sulphonic acid (PTSA) as catalyst and characterized by FT-IR spectrum and DSC. The ATPI modified epoxy resin (AME) was cured by 4, 4-diaminodiphenyl...
Pulverized mold residue of cured epoxy molding compound was reused to produce poly (vinyl chloride) composites with the aim to recycle resources in a more profitable and environmental concern way. The mold residue powder with functional groups on the surface was reactive to polar resins as the results of FT-IR spectrum (FT-IR). Mechanical tests, differential scanning calorimetry (DSC), vicat softening...
Epoxy polymers reinforced with a premixed epoxy/nano-silica masterbatch or dry non-surface-treated nano-silica and ground micro-silica flour were compared. Cured plates of epoxy containing both nano-particles (up to 15 %wt) and micro-particles (up to 51 %wt) of silica were produced and tested. The glass transition temperature, Tg, of the epoxy was measured using differential scanning calorimetry (DSC),...
With fast development of electronic packaging, the conductive adhesives were widely used in surface mount and chip interconnection. As an alternative to solder, it has many advantages, such as low processing temperature, less environment contamination and fine pitch capability. However, conductive adhesive joining technology also simultaneously faces a lot of challenges. The major problem of current...
Despite the introduction of newer die attach adhesive material such as die attach films, conventional die attach epoxy remains to be the most important material for die attach process in semiconductor packaging. In response to the demand for high bonding strength and thermal dissipation while maintaining good manufacturability, the requirements on the behavior and characteristics of the epoxy are...
In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme. In addition, two low filled packaging polymers are included for comparison. The characterization scheme consists of the steps sample preparation, measurement of the material data, and modeling the material behavior. The dasiasample preparationpsila step included a DSC analysis to understand...
A dye-sensitized solar cell (DSC) is a solar cell that uses an anatase film as a photovoltaic device. Since the anatase film and dye play the roles of electron carrier and electron generator, respectively, in the DSC, porous anatase films are desirable. In this paper, in order to develop a low-cost fabrication process for the photovoltaic device of the DSC, photocatalytic titanium oxide film deposition...
In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme. In addition, two low filled packaging polymers are included for comparison. The characterization scheme consists of the steps sample preparation, measurement of the material data, and modeling the material behavior. The dasiasample preparationpsila step included a DSC analysis to understand...
In this report we present the synthesis of two kinds of epoxy-curable diazo-coupling phenol novolac derivatives which gives rise to high crosslinking densities with reduced free volumes and tie-up the molecular segments and insert bulky substituent such as aromatic groups by inflammable N element. The synthetic procedure and material characteristics are discussed, and the flame retardancy and thermostability...
Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the -Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the...
Fiber-reinforced composites are used as insulating layers in PCBs to reduce thermal residual stress and warpage due to their low coefficient of thermal expansion (CTE) and high elastic modulus. The composite prepreg is laminated on patterned copper layers by hot-press molding process to apply temperature and pressure cycles. In this study, the lamination process of glass/epoxy woven composite in the...
The electrical surface resistivity of polymer base coating was investigated in arc-decomposed SF6 gas. The thickness of more than 100 mum was found necessary to prevent the adverse effect of arc-decomposed SF6 gas, which penetrated the coated film and deteriorated the insulation properties of the base material. The effect of the cure condition of the coated film was also investigated by using differential...
In the paper, PEEK(poly(ether ether ketone)) was added to the epoxy resins as a modifier to improve thermal and mechanical properties of the cured resins. The heat effects of curing epoxy resin composites with PEEK were investigated by differential scanning calorimetry (DSC) technology and the morphologies of the fracture surface by scanning electron microscope (SEM). The relationship between the...
In order to accommodate environmental considerations, the environmentally friendly and biocompatible materials become increasingly important and attract a lot of research interest in recent years, while application of biocompatible materials are still in its infancy. In this paper, the biochemical building blocks, amino acid is used as a novel environmentally benign and biologically compatible curing...
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