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This paper proposes a thermal network parameter estimation method to find RC parameters of the Cauer network using cooling curve of IGBT module. The solutions are developed by exploiting the relationship between thermal network parameters and time constants of junction temperature response curves. Experimental tests are performed to validate the accuracy of the developed method. Advantages of the...
This contribution deals with the design of a water-cooled on-board charger for electric vehicles. The charger consists of two power stages: a bridgeless power factor correction boost rectifier and an isolating resonant converter. Though wide-bandgap semiconductors with excellent reverse recovery behavior exist, the comparably high cost still advices the use of traditional silicon semiconductors. However,...
Power IGBT module is one of the crucial factors limiting overall performance, reliability and cost of Hybrid and Electric Vehicles (HEV/EV). A clear booming market of automotive power module has been seen with the accelerated development of HEV/EV. Although a series of standard and custom automotive modules meeting most of customer requirements had been proposed recently, the continuous development...
Insulated gate bipolar transistor (IGBT) modules are essential in power electronic application. Due to the improvement in chips and packaging, the maximum operation junction temperature Tvj,op of the latest IGBT module has been increased up to 175°C, comparing to 150°C of the previous generation. With the enhancement of power density, its application at high temperature gives rise to more concerns...
Power converter is going in the direction of the high power density. Aimed at the trend, a 1200V/300A planar double-side cooling IGBT module has been designed, packaged. Comparing with conventional IGBT module, Parasitic inductance is reduced by 43.26%; Thermal resistance is 26.7% lower; Turn-on time and turn-off time are decreased by 35% and 15.8% respectively; The total power losses are reduced...
Compared with single-side cooling inverter, double-side cooling inverter is more advantageous for the application of electric vehicle in terms of efficient cooling performance, mechanical robustness and high power density. IGBT short-circuit fault is one of the detrimental factors to cause the whole inverter failure. From the perspective of inverter, this paper analyzed the fault condition of single...
We applied advanced heat dissipating technology to reduce heat resistances of the key devices to increase the output power density of the inverter. The IGBT modules were direct water-cooled, and the integrated DC-link capacitor was indirect water-cooled. We conducted the simulation and the test, which proved that reducing the heat resistances was effective to improve the output density of the inverter...
The global environmental activities in industries requires for motor drive inverters to expand application fields to higher capacity and with higher reliability. The paper introduces some of developments satisfying the requirements. The first development is a cell unit rated at high current in the range of kA. The advanced paralleling technologies are taken in both electric and cooling designs. The...
High-current, large-area single SiC JBS diodes rated at 650V-200A and 1200V-100A were fabricated on a 150mm platform that demonstrate a low VF of 1.5V. The diodes exhibit a specific differential resistance, Rdiff, sp, of 0.74 and 1.65 mΩ-cm2, respectively. The devices were tested with similarly rated Si-IGBTs and the reduction in switching losses and QRR evaluated. The high-current diodes have also...
Packaging of power semiconductor modules is facing huge challenges from automotive customers in terms of performance, temperature, reliability, weight, volume and cost etc. It is believed that choice of the power module structure, material and assembly technology are key factors for mitigating the challenges. Among them, the cooling structure and of the module is of most importance to address these...
Three-phase voltage-source inverters are becoming widely used in grid applications, due to the increased utilization of renewable energy resources such as photovoltaic (PV) systems. The connection of the inverter to the grid must not deteriorate the voltage quality at the point of the common coupling (PCC). Therefore, the injected current harmonics must not exceed certain level. Reduction of the injected...
The steadily increasing demand from the particle physics community for higher beam energies and higher integrated beam luminosity has reinforced the necessity for new accelerator equipment, frequently breaking with conventional technologies. One of the fields where new and innovative engineering is required and where interesting developments are ongoing, is the domain of fast switching of high DC...
3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application. A dynamic electrical test of the package is presented.
This paper deals with a 3-D development of a thermal model of a power electronic converter mounted on the generator shaft and rotating with it. The dimensions of the heat sink are determined, and the temperature gradients of the converter, its heat sink, and shaft during natural and forced convection are analyzed for variable rotor speeds. It is shown that the chosen sizes of the insulated gate bipolar...
For the double-sided assembly, thermal stress is one of the key factors that affect the reliability of the assembly. Therefore, we need to reduce thermal stresses in the double-sided assembly by optimizing size and structure. In this study, we fabricated a kind of double-sided assembly using metal tubes instead of bonding wires because the metal tube could load the higher current density than bonding...
Accurate thermal dynamics modeling of high power Insulated Gate Bipolar Transistor (IGBT) modules is important information for the reliability analysis and thermal design of power electronic systems. However, the existing thermal models have their limits to correctly predict these complicated thermal behaviors in the IGBTs. In this paper, a new three-dimensional (3D) lumped thermal model is proposed,...
This paper puts forward an analytic method to calculate the power device loss of VFD (variable-frequency drive) and the temperature rise of water-cooled radiator. Detailed analysis and design for the loss of power devices, the temperature rise at inlets and outlets of water-cooled radiator, the temperature rise of convection heat transfer of cooling, the temperature rise of heat conduction of water...
Continuous variable series reactors (CVSRs), as a cost effective alternative to flexible AC transmission system (FACTS) series compensators, have been proposed to continuously vary the line reactance and control the power flow. The development of the power electronics based dc controller (DCC) is essential and unique to meet the need of CVSR in utility transmission grid applications. In addition to...
IGBT power supply is a single-phase H bridge inverter capable to provide current of ±12kA with 1MA/sec ramp rate. This paper describes performance requirements, ratings, inverter design calculations, multimodular topology, protections, fast control, symmetrical layout, bus bar engineering, and cooling requirement and test results.
Lesnicar and Marquardt introduced a Modular Multilevel Converter (MMC) topology back in 2003. Although this topology has received a great deal of attention in recent years by both the research community and industry, hitherto no steady-state model has been developed which accurately captured all the relevant power losses while being computationally light. Hence, the aim of this paper is to introduce...
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