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The steadily increasing demand from the particle physics community for higher beam energies and higher integrated beam luminosity has reinforced the necessity for new accelerator equipment, frequently breaking with conventional technologies. One of the fields where new and innovative engineering is required and where interesting developments are ongoing, is the domain of fast switching of high DC...
This paper presents the assembly of a half-bridge switch taking into account the actual current commutations encountered in power converter topologies. So, rather than optimizing the connection between an active switch (e.g., IGBT) and its anti-parallel freewheeling diodes, a novel approach is proposed which favors compact interconnection of the high-side transistor with the low-side diode and vice-versa...
This paper presents an advanced integration approach for vertical power semiconductor devices. Based on recently demonstrated surface bump technology, it advances previous work by implementing a flip-chip stacking concept, which results in an improved solution for space exploitation, device performance optimization and assembly process simplification. As a case study, the design of a high-voltage...
The compact main circuit has many advantages, such as reducing volume and weight, saving costs and convenient for transportation. This paper presents three key problems including switching power supply, sampling and protection system, and cooling system. Through simplifying circuit and optimizing device parameters, the switching power supply can provide multiplex regulated power supplies with 540...
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