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MOSFETs in an RF amplifier dissipate high heat flux due to switching and conduction loss. MOSFET's junction temperature affects product reliability adversely. This paper presents a thermal management method used in an RF amplifier development with junction to case temperature rise transient analysis, Thermal Interface Material (TIM) testing, clamping structural Finite Element Analysis (FEA), and Computational...
Thermal design of PCBs (Printed Circuit Boards) is important for electronic packages which are intended to be primarily cooled by heat flow into the PCB. Designing the required PCB coverage area through detailed numerical simulations can be computationally expensive. This article presents a quick approach to predict Junction-to-Air thermal resistance of exposed pad packages based on pre-generated...
Fierce competition drives continuous improvement of products and product development processes in consumer electronics. The DIDOV (Define, Identify, Design, Optimize, and Verify) version of the Design for Six Sigma (Dfss) approach is widely recommended a means to improvement, especially in R&D environments. Due to the wide field of application, the Dfss-DIDOV method is formulated in very abstract...
Calculation and display of a thermal bottleneck scalar field as an integrated part of a CFD simulation enables a practitioner to interact with and understand the physical mechanisms by which heat is removed from an electronics system. By applying the characteristics of this thermal bottleneck scalar to heat sink design aspects, one can identify near optimal solutions with a minimal number of simulations...
In the dream chip project of ASET, a 3D-integrated package is developed. The chip has multi layered structure and heat generation density in the chip becomes much larger than conventional single layered chip. Therefore, thermal design, which is temperature management, of the chip is very important. The dream chip has complex structure and there exist so many parameters for thermal design. If we try...
Technological advances driven by the DRAM market demands resulted in thermal challenges arising from increasing power and decreasing space for cooling. This is exacerbated by the packaging of multiple devices within the same footprint based on die stacking or package stacking. In view of the thermal concerns, we conducted a comprehensive thermal study of chip stack and package stack devices at both...
The accurate prediction of operating temperatures of temperature sensitive electronic parts at the component, package, board, and system level CFD simulations has engaged the engineering community for a number of years. The primary challenge has been that near-exact physical models of such components (known as detailed thermal models, or DTMs) are difficult or implement directly in system designs...
The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of modern microsystem demands. Carbon nanotube (CNT) has been proven to be a potential material for micro-cooler because of its superior advantages including high thermal conductivity, good mechanical property and so forth. And there emerges various applications of CNT in the micro-cooler system. In the...
Due to rising thermal concerns from increasing power densities and industry demands for shorter development cycle times, we have developed quick solutions to assess the thermal performance of the FBGA package, one of the most widespread package options. We have designed a user friendly tool that provides a quick estimation of the junction to ambient thermal resistance of the FBGA package under JEDEC...
Electronic enclosures commonly use fans, including axial fans, impellers and centrifugal blowers, when cooling by forced convection is required. Computational fluid dynamics (CFD) models of electronic enclosures have traditionally employed abstract fan models. These abstract fan models possess highly simplified fan geometries and numerical flow characteristics. The fan geometry is usually a rectangular...
Forced convection heat transfer is limited with the fan flow rate or pressure drop. Therefore, it is necessary to develop novel cooling technologies that can enhance forced convection. A new heat sink design is proposed for electronics cooling applications. The objective of this study was to develop a new heat sink design, which increases heat transfer properties while containing the pressure drop...
The Wireless Telecom Industry is moving into a new age wherein remote data transmission capabilities must meet the demands of versatile mobile devices. These needs will be met by powerful new innovations such as 4G and WiMax. The radio control devices that are responsible for delivering the newest technologies to end-users are subject to stricter requirements of power than predecessors in compact...
As the power dissipated by advanced microelectronic devices continues to increase, the demand for reliability also increases. This increases the requirements on the thermal performance of every part of the system, including the heat sink. One of the objectives of this study is to examine the effect of shape of the heat sink fins on the thermal performance of the system. The pressure gradient from...
Rapid advances in the semiconductor process technology have led to miniaturization of transistor features and advent of multi-core architecture. At the silicon-level while bus speeds, features and functionalities are increasing, at the system-level, there is a steady and incessant trend of volume reduction, compact component placement on the board and noise reduction. Thermal margining tools (TTs)...
Thermal relief is a technique used by printed circuit board (PCB) designers to thermally decouple soldering pads from large copper areas, in order to avoid excessive heat transfer from the pads during the soldering process, which would result in late melting or even no melting at all of the soldering alloy. Although from the manufacturing point of view this is a clear and imperative requirement, we...
Increasing thermal demands of high-end servers require increased performance of air-cooling systems in order to meet industry requirements. Increased air cooling performance will be attained through efficient distribution of the air flow to multiple electronic modules and improved aerodynamic power conversion efficiency of the server air movers and incorporating inter-stage air flow directional control...
Small Form-factor Pluggable (SFP) transceivers are commonly used in fiber optics based networks. Detailed CFD model demands a lot of mesh counts and is computationally prohibitive in system and board level simulations. In the present study, detailed SFP models have been simulated at 24 different boundary conditions consisted of four system airflow velocities, three power dissipations and two PCB board...
This paper discusses experimental and theoretical results for several embodiments of pulsed air jet technology. Pulsed air jets, also called synthetic jets, require an implementation strategy that is quite different from steady-flow devices such as fans and blowers. Simply replacing a fan with a synthetic jet will most likely result in a failure to cool a device as intended. The principal goal of...
A notebook computer thermal management system is analyzed using a commercial computational fluid dynamics software package (ANSYS Fluent). The active and passive paths that are used for heat dissipation are examined for different steady state operating conditions. For each case, average and hot-spot temperatures of the components are compared with the maximum allowable operating temperatures. It is...
High brightness light-emitting diodes (HB LEDs) for the automotive exterior lighting system are required to maintain the stable light output irrespective of the ambient temperature. We design the flexible substrate with the thick trace layer for heat spreader for the conventional process of printed circuit board (PCB). The performance of flexible PCB substrate with the thick copper layer of 200 um...
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