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The replacement of Au and Al wires with Cu wires in wire bonding has become an emerging trend in IC packaging nowadays. Although some research works have been carried out for the applications of Cu wire bonding, they are mainly focused on the processing and material issues of Cu wire bonds. However, the Cu in the wire bonds may diffuse into the Si chip and impose reliability threats to the silicon...
In this contribution, our progress in development of deformable single-crystalline-silicon electronics by modification of the previously reported ultra-thin and flexible CIRCONFLEX technology is presented. Additional deformability/reliability is achieved by lateral segmentation of silicon/dielectric layers and connecting these using flexible electrical interconnect. In the current study, segment thickness...
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