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With the development of marine industry, the requirements for safety and reliability of deep-sea operation equipment are getting higher and higher. Experimental test is an important part of detecting the performance of deep-sea operation equipment. The deep-sea pressure environment simulation device is used as a device to detect the performance of deep-sea operation equipment. The requirements of...
Based on nano two-phase composite magnetic material, a design and optimization scheme of energy-saving wind power grid contactor is proposed, which solves the problems of traditional contactor's high iron loss, low speed and large AC noise. In this paper, the electromagnetic system of the contactor is redesigned by the characteristics of high remanence, high coercivity and wide hysteresis loop of...
Aluminium wires are widely used in power electronics modules to connect power semiconductor devices and other parts of the module electrically. Recently, other interconnect techniques have been proposed such as ribbon bond to improve the reliability, performance and reduce costs of power modules. The reliability of ribbon bond technique for an IGBT power module under power cycling is compared with...
Mechanical impact or shock resulted from inevitably transport or usage of electronic equipment, may cause great stress and strain in the electronic package, even lead to the failure of electronic equipment, so it's of great significance to explore the mechanical behavior of electronic packaging under drop/impact. In all kinds of package, 3D System in Package with Through Silicon Via has become a hot...
In this study three-dimensional finite analysis models of 3D micro-scale chip scale package (CSP) solder joints were set up. The stress-strain distribution of micro-scale CSP solder joints was obtained by finite element analysis under the condition of random vibration load. The influence of different solder, pad diameter and solder joint volume on the stress-strain of micro-scale CSP solder joint...
Integrated circuits (ICs) undergo dimensional reduction and the functional unit of density dramatically increases, the reliability issue becomes more critical, especially with respect to three-dimensional (3D) silicon integration technology. Through-Silicon Vias (TSVs) technology is one of the most prominent feature used for interconnecting between chips. Since TSVs contain interfaces of heterogeneous...
Three-dimensional structure has been achieved using interlayer connecting technology with double-side solder bump and the lifetime of the solder joints under thermal shock test has been forecasted by finite element method. The simulation result presents that the stress at the interface between 0.76mm solder bump and PCB is evidently higher than that in other places. The interface between 0.76mm solder...
Electronic components continue to high reliability, high performance, multi-functional, miniaturization direction. High-density integrated ball grid array (BGA) surface assembly technology is widely used in the field of microelectronics packaging. In this paper, the crack failure behavior of plastic ball grid array (PBGA) is studied under mechanical vibration load. The stress - strain distribution...
Hyperbolic wire spring connectors have been widely used in some systems with high reliability requirements. The contact force is a key point to keep reliable electric contact. In this paper, firstly the range of contact force of existing hyperbolic wire spring connector was calculated by both the theory of mechanics of materials and finite element analysis. Then the allowed extreme contact forces...
This article considers the work done to find a suitable group implementation for the creation of new cryptosystems which work is based on the use of finite non-commutative algebraic groups. In particular, some subgroup structures of matrix groups over finite fields are described, and one of the possible methods for representing of open texts as elements of the group is used. At the preliminary stage...
The key role that underfill materials play in highly reliable, advanced flip chip organic packages has generated an increased focus on their behavior and structure. One such behavior relates to the observation of filler separation from the resin matrix which, to date, has been predominantly attributed to gravity or capillary flow. The phenomenon of silica filler separation is discussed in the context...
This study focuses on the understanding of moisture diffusion physics under use conditions (UC) and its impact on definition of qualification requirements. It uses computational modeling and detailed measurements of UC to challenge some long held assumptions used in moisture risk assessments. It introduces the quantity called "Stable Wetness" to account for moisture amount present in the...
Wafer Level Chip Scale Packaging (WLCSP) designs, including Wafer Level Fan-Out (WLFO) technologies, are gaining more and more applications for next generation small and thin devices. Since the WLCSP and WLFO packages are mounted directly on the motherboard without a substrate as a buffer, the large coefficient of thermal expansion (CTE) mismatch between the silicon die and the motherboard makes the...
There are increasing interest in high temperature endurable sensor or device packaging solution for a set of wide ranging applications that include oil and gas production or deep sea exploration, advanced automotive application, aerospace, more electric aircraft initiative (MEA) or engine health management (EHM) systems, geothermal energy harvesting as well as other renewable energy industries. Besides...
Fan-Out (FO) chip on substrate is one of the fan-out solution for package integration. This solution brings the short interconnection between die to die for excellent electrical performance. Fan-Out chip on substrate device provides excellent electrical performance in multi-die connection,. The multiple re-distribution layer (RDL) processing is implemented in advance multi-dies FO chip on substrate...
This paper deals with the area of solder joints reliability and narrower focus is on solder joints on SMD ceramic resistor arrays in configuration 8x0603. These SMD ceramic resistor arrays are soldered on 30 testing boards and every board includes two packages. Testing boards are exposed to influences of temperature changes in the temperature chamber. The range of temperature changes is from −25 °C...
This paper presents the design, FEM modeling and experimental characterization of the elastic-plastic behavior of electroplated gold specimens undergoing tensile loading. The test structures are designed and optimized to achieve high stress values in the double-clamped specimen with a rectangular cross-section in the middle of the test structure. High stresses in the specimen are achieved by using...
A finite element analysis of the electromigration process in metal interconnects can now be performed using the ANSYS program. The analysis is based on the model that includes all the driving forces of electromigration—diffusion gradient, electric current, stress, and temperature gradients. The electromigration model is implemented in the framework of 2-D and 3-D coupled-field elements. Diffusion,...
The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch in Coefficient of Thermal Expansion (CTE) between the materials used in the package induces stress on the solder interconnects and results in deformation and stresses. Finite element tools are widely used for rapid design optimization and also...
This paper deals with vibrational behaviors of blades with cracks which are key components in rotating machines. However, since modelling and analysis of real blade is a complex problem, a simplified cantilever beam with both chordwise (in X-Y plane) and flapwise (in X-Z plane) motion are modeled instead. Finite Element Method (FEM) is used to model beam and to investigate its natural frequencies...
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