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The cultural theory of naïve dialecticism, denoting Chinese lay beliefs about expectation of change and tolerance of contradiction, was employed to examine Chinese and European Americans' representation and evaluation of their romantic partners and relationships across three studies. We found that Chinese were more likely than Euro‐Americans to spontaneously describe their partners with contradictory...
Living together in culturally plural societies poses numerous challenges for members of ethnocultural groups and for the larger society. An important goal of these societies is to achieve positive intercultural relations among all their peoples. Successful management of these relations depends on many factors including a research‐based understanding of the historical, political, economic, religious...
There are increasing interest in high temperature endurable sensor or device packaging solution for a set of wide ranging applications that include oil and gas production or deep sea exploration, advanced automotive application, aerospace, more electric aircraft initiative (MEA) or engine health management (EHM) systems, geothermal energy harvesting as well as other renewable energy industries. Besides...
Infrared (IR) sensor module deploy for hazardous gas leakage detection is crucial to provide and maintain offshore Oil & Gas platform asset integrity and improve operational risk management by avoiding accidental disaster and mitigating risk associated with danger involve in oil production. These sensor modules must remain robust under harsh ambient environment. Hence, designing novel high temperature...
This paper reports on the development of packaging technology for the assembly of 30µm pitch micro Cu pillar bump (15µm diameter) on organic FCCSP substrate having bare Cu bondpad without NiAu or OSP surface protection. The assembly was performed by thermal compression bonding (TCB) with non-conductive paste (NCP). Finite element modeling and simulation were carried out to understand the Cu pillar...
There is a big push in the aerospace industry toward more electric aircraft (MEA)[1-2]. The progress is necessary to improve the overall power efficiency and reliability of the aircraft. Aircraft engine health monitoring (EHM) system is one the major effort from aircraft manufacturer toward MEA. This system employs arrays of strategically placed sensors that need to maintain high reliability and robustness...
The assembly capability of 30μm ultra-fine pitch Cu pillar flip chip interconnect on a two-layer FCCSP organic substrate with a chip size of 8mm × 8mm × 0.1mm chip was demonstrated by using thermal compression bonding with non-conductive paste (TCB-NCP) to mitigate the issue of coefficient of thermal expansion (CTE) mismatch between silicon chip and organic substrate. A method, developed to quantify...
Cu pillar technology can cater for high I/O, fine pitch and further miniaturization requirements compared to wire bonding and conventional flip chip technologies. However, chip-package interaction (CPI) for low-k chip is a critical challenge for Cu pillar technology under assembly process and temperature loading due to stiffer Cu pillar structure compared to conventional C4 bump. Thermo-compression...
The cracking of the brittle ultra low-k dielectrics on advanced node silicon devices is a great concern for assembly processes. It is attributed mainly to various combinations of the Chip-Package-Interaction (CPI) effect. This challenge is further amplified by the adoption of Cu pillars to replace conventional solder bump flip chip interconnects as device bump pitch shrinks and the demand for higher...
High performance, multi functional and package miniaturization will be the main driving forces that propel the future trend and development of fully integrated multi silicon dies stack using through silicon via (TSV) packaging technology. This paper serves as an extension of the foregoing paper, where TSV-micro C4 solder interconnect were used and stack up to 4-die compared to the 2-die stack previously...
Multi silicon dies stack using through silicon via (TSV) is required for higher performance, greater package miniaturization and more functionality electronic device. A through silicon interposer (TSI) enables interconnect pitch matching between a high I/Os top chip and a low cost organic substrate. TSI also mitigates the risk of extreme low-K (ELK) layers delamiantion. This paper demonstrates the...
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