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The HFSS electromagnetic simulation model of a complete transmission path structure was established, analyzed the signal integrity of complete transmission path in high frequency and acquired the return loss of complete transmission path based on the model. The effect of external diameter of via, inner diameter of via and height of via to signal integrity of complete transmission path were studied...
In this study three-dimensional finite analysis models of 3D micro-scale chip scale package (CSP) solder joints were set up. The stress-strain distribution of micro-scale CSP solder joints was obtained by finite element analysis under the condition of random vibration load. The influence of different solder, pad diameter and solder joint volume on the stress-strain of micro-scale CSP solder joint...
Established embedded substrate microscale ball grid array solder three point bending stress and strain finite element analysis model, analyzed the solder joint materials, spot diameter and the influence of the bending stress and strain of solder pad diameter, the results show that the torque load, the embedded type substrate microscale BGA solder joint array of maximum stress and strain are occurred...
A high‐yielding, copper‐catalyzed dearomatization reaction of indole from 2‐methylindole‐derived oxime acetates was realized, providing access to structurally novel spiro[indoline‐3,2′‐pyrrolidine] derivatives in 67–98% yields. When the C‐2 position of the indole was not substituted, azacarbazole derivatives were obtained in moderate yields. This transformation provides an efficient approach to access...
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