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The requirement of integrating a large number of heterogeneous cyber and physical entities in cyber-physical systems (CPSs) motivates the use of a service-oriented architecture (SOA), which can support the composition of two or more available functionalities to form a complex service. This paper presents a context-sensitive service composition framework in CPS with dependability requirements. Firstly,...
The process of synthetically producing an image illustrating merged parts of multiple source images is usually known as image morphing. In this work a system is presented which morphs more than two source images to one output image. Its focus lies on using ancient coin images belonging to a common coin type. Nowadays, these coins can be worn or damaged. The goal of the presented morphing framework...
Random process variations are often composed of location dependent part and distance dependent correlated part. While an accurate extraction of process variation is a prerequisite of both process improvement and circuit performance prediction, it is not an easy task to characterize such complicated spatial random process from a limited number of silicon data. For this purpose, kriging model was introduced...
In many power distribution systems when three-phases and single-phase loads are combined is common to use asymmetrical transformers banks. Although different connections can be used, the most usual for mixes loads, is the wye/delta-grounded three elements transformer bank where one of the transformers, the one with the higher capacity, is called the lighting transformer and the other two power transformers...
Basic film step coverage and gap-fill data has been consolidated and compared with the observed thin film CVD kinetics trends. Based on some assumptions regarding reaction kinetics, obtained correlations are believed to be applicable for an optimization of ultra small gap filling in deep submicron integrated circuit technology.
We present a practical, systematical method for the evaluation of the soft error rate (SER) of microelectronic devices. Existing methodologies, practices and tools are integrated in a common approach while highlighting the need for specific data or tools. The showcased method is particularly adapted for evaluating the SER of very complex microelectronic devices by engineers confronted to increasingly...
For several decades, the output from semiconductor manufacturers has been high volume products with process optimisation being continued throughout the lifetime of the product to ensure a satisfactory yield. However, product lifetimes are continually shrinking to keep pace with market demands. Furthermore there is an increase in dasiafoundrypsila business where product volumes are low; consequently...
A planar edge termination technique of trenched field limiting ring is investigated by using 2-dimensional numerical analysis and simulation. The better voltage blocking capability and reliability can be obtained by trenching the field-limiting ring site which would be implanted. The trench etch step makes the junction depth deeper so that junction curvature effect and surface breakdown are less happened...
The challenges of deriving early-adopter competitive advantage, even with fabless access to process technology, through leveraging features offered by the advanced, and possibly disruptive, process technologies in real SoC products, are outlined. A structured methodology for addressing these challenges, and bridging the gap between process and design, sufficiently early in the development cycle to...
The dramatic increase in leakage current, coupled with the swell in process variability in nano-scaled CMOS technologies, has become a major issue for future IC design. Moreover, due to the spread of leakage power values, leakage variability cannot be neglected anymore. In this work an accurate analytic estimation and modeling methodology has been developed for logic gates leakage under statistical...
This paper presents an innovative structure based on 3 dimensional integration technology, where ultra thin inter layer dielectric enables a dynamic threshold voltage (VTH) control. A sequential process flow is proposed to fabricate 3D devices with dynamically tunable VTH. This ability can be exploited to design SRAMs cells with increased stability and surface density compared to planar technology...
Plasma-exposed Si surface related to Si recess in source/drain region was investigated in detail for various superposed bias configurations with frequencies of 13.56 MHz and 400 kHz. Two different bias powers were utilized by an inductively coupled plasma reactor (ICP). The surface layer (SL) and the interfacial layer between the SL and Si substrate (IL) were analyzed by spectroscopic ellipsometry...
We consider the problem of approximating an integer program by first solving its relaxation linear program and "rounding" the resulting solution. For several packing problems, we prove probabilistically that there exists an integer solution close to the optimum of the relaxation solution. We then develop a methodology for converting such a probabilistic existence proof to a deterministic...
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