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Key process features of a scaled, high-performance planar FBC memory fabricated on 25-nm undoped Si and 10-nm BOX SOI substrates are presented. Back-Gate (BG) doping process is revealed to be a critical part of the FBC integration. BG dopant loss due to oxidation and high-temperature processes is minimized to enable high performance at scaled diffusion widths (W<;100 nm). Integrating BG doping...
Recent device developments and achievements have shown that undoped channel planar Fully depleted SOI devices are becoming a serious alternative to Bulk technologies for 22nm node and below. This planar option seems to be even easier than non planar FinFET devices. This paper will report the main results obtained with this technology and will compare these results with the state of the art of Bulk...
We present circuit design aspects of fully depleted extremely thin SOI (ETSOI) enabling 22 nm low-power CMOS and beyond, and demonstrate that all devices including analog, I/O, and passive devices can be fabricated in the thin silicon layer. Excellent device matching, gm/gds scaling to small gate length, good RF performance, and absence of history effect are the main features of the ETSOI technology.
We present a study of the effects of substrate orientation and longitudinal channel stress on the performance of extremely thin silicon-on-insulator (ETSOI) MOSFETs with gate lengths down to 25 nm. We find that short-channel electron and hole mobilities follow the long-channel mobility trends versus substrate orientation and longitudinal channel stress. We show that with respect to (100) silicon-on-insulator...
The performance and threshold-voltage variability of vertical SOI FinFETs are compared against those of planar fully depleted SOI MOSFETs with thin buried oxide, via three-dimensional device simulation with atomistic doping profiles and gate line-edge roughness, for the 22 nm CMOS technology node (25 nm gate length). Compact modeling is then used to estimate six-transistor SRAM cell performance metrics...
Limitations and challenges of FD-SOI MOSFETs are investigated in terms of intra- and inter-die Vt-variations, and capabilities of the body-bias control and multi-Vt MOSFETs. State-of-the-art planar FD-SOI MOSFETs are described, citing the SOTB (silicon on thin box) MOSFET as an example. FinFETs are also discussed; their challenges are clarified, and some solutions are proposed, such as high-density...
In this paper, the performance of Zero capacitor RAM (Z-RAMreg) devices, developed in a 45 nm SOI CMOS technology, is compared with both symmetric and asymmetric doping schemes. It is shown that the asymmetrically doped Z-RAM (AD) devices offer much better memory performance compared to the symmetrically doped Z-RAM (SD) devices.
Higher sensing margin and longer retention time are critical issues for commercializing 1T DRAM. In this paper, we propose a body-raised double-gate structure to improve sensing margin and retention time of 1T DRAM and confirm the improvements through 3D simulation. This structure shows about 20% higher sensing margin than the planar structure. We have achieved longer retention time by using high...
A Capacitorless IT-DRAM cell using gate-induced drain leakage (GIDL) current for write operation was demonstrated for the first time on FDSOI substrate, 9.5 nm silicon film and 19 nm BOX. 20 nm gate scaling improves 20% memory effect amplitude. GIDL mechanism allows low bias, low power, fast write time and does not affect intrinsic retention time. A similar value of 10 ms at 85degC is obtained like...
A new integration scheme is presented to solve device and manufacturing issues for extremely thin SOI (ETSOI) technology with high-k/metal gate. Source/drain and extensions are effectively doped by an implant-free process to successfully reduce series resistance below 200 Omegaldrm. A zero-silicon-loss process is developed to eliminate loss of thin SOI layer during gate and spacer processes, enabling...
Systematic study on hole mobility in gate-all-around (GAA) multiple Si nanowire (NW) pFETs on (110) SOI is presented for the first time. [110]-NWs show high mobility, 2.4times enhancement over universal (100) mobility, even in high Ninv region and in narrow (25 nm) NWs. Furthermore, effects of uniaxial tensile stress are also investigated, indicating that [110] direction uniaxial stress is effective...
CMOS devices with high-k/metal gate stacks have been fabricated using a gate-first process flow and conventional stressors at gate lengths of 25 nm, highlighting the scalability of this approach for high performance SOI CMOS technology. AC drive currents of 1630muA/mum and 1190muA/mum have been demonstrated in 45 nm ground-rules at 1V and 200nA/mum off current for nFETs and pFETs, at a Tinv of 14...
Sources responsible for local and inter-die threshold voltage (Vt) variability in undoped ultra-thin FDSOI MOSFETs with a high-k/metal gate stack are experimentally discriminated for the first time. Charges in the gate dielectric and/or TiN gate workfunction fluctuations are determined as major contributors to the local Vt variability and it is found that SOI thickness (TSi) variations have a negligible...
In this work we propose a unified model for the low-field effective electron mobility in SOI and DG-MOSFETs with ultrathin SiO2/HfO2 gate stacks, different substrate and channel orientations and uniaxial stress conditions.The model accounts for quantum-confinement effects in the MOSFET channel. Next, we apply this mobility model to a 1D quantum drift-diffusion (QDD) transport model in order to investigate...
The paper presents a detailed study on the idle leakage reduction techniques on partially depleted silicon-on-insulator (PD-SOI) CMOS SRAM. The most promising leakage reduction techniques that have been proposed are introduced, analyzed and compared into 65 nm low-power PD-SOI technology, taking into account all the SOI specific effect. Especially, it is shown that the leakage reduction techniques...
In this paper we discuss some aspects of antennas in real designs in SOI technology, and show how the concepts manifest themselves in actual chips, where second-order effects such as resistance and the details of the processing sequence can play an important role. We also discuss the ramifications of a more recent technique which inserts bulk contacts into the SOI design, thereby imposing a bulk-like...
Ultra Thin Body Si-On-ONO (UTB SOONO) transistors with ultra thin spacer are successfully demonstrated and evaluated. They have shown increased driving current more than 30% compared with conventional UTB SOONO transistors with thick spacer due to reduced source/drain resistance without short channel effect degradation by using thin spacer. In this paper, it is shown that thin spacer technology is...
In this paper, the fabrication and characterization of strained Ge-on-insulator transistors with gate lengths down to 65 nm is described and also, for the first time, RF characteristics of sub-100-nm gate-length Ge MOSFET are reported. It is concluded that considerable further improvement is possible in both the performance and the short-channel characteristics by increasing the strain in the channel,...
A scaled, undoped, thin-BOX, planar FBC technology is demonstrated for the first time, featuring 10-nm BOX, 25-nm SOI, high-k, metal gate, separate back-gate (BG) doping, and raised source-drain epitaxy. Retention of a minimum 3-muA sensing window for 100 ms, in devices with 60-nm gate-length (Lg) and 70-nm diffusion width (W), represents the best retention time of all sub-100-nm FBC devices. FBC...
For the first time, ultra low IOFF (16.5 pA/mum) and high IONN,P (2.27 mA/mum and 1.32 mA/mum) currents are obtained with a multi-channel CMOSFET (MCFET) architecture on SOI with a metal/high-K gate stack. This leads to the best ION/IOFF ratios ever reported: 1.4 times 108 (0.8 times 108) for 50 nm n- (p-) MCFETs. We show, based on specifically developed integration process, characterization methods...
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