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A failure analysis of a product due to the on chip ESD structure defects is presented in this paper. ESD is one of the most important reliability issues in the design of integrated circuits. About 40% of the failure of integrated circuits is related to ESD/EOS stress. In order to improve the reliability of ICs, the design of ESD protection is increasingly necessary for the modern semiconductor industry...
To be compliant with electromagnetic compatibility standards, integrated circuits such as microcontrollers have to be robust to fast transient burst tests. Because of high voltage and fast transient voltage variations used no measurement is possible during the stress. Lack of information makes the debug of a product a real challenge. The objective of this work is to provide a measurement method which...
Since increasing complexity of the device, harsh environment, the growing importance of applied electronic systems, life assessment for the DC-DC converter becomes imperative. There are some weaknesses in the existing methods. A method for key components determination used in DC-DC converter life assessment was presented in this paper. Firstly, the simulation circuit of the converter was built. According...
Recent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity of digital integrated circuits and clarifying its origin. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip are combined with electric stress to characterize the influence of...
Most integrated circuit ESD damages are caused by CDM stresses. This paper discusses CDM failure modes. The most common such failure is damage to the gate oxide in the MOS device. A new methodology that uses a gate oxide damage monitor and modified VFTLP testing is proposed for assessing CDM protection effectiveness and robustness in I/O circuits. A test structure for such an evaluation is also introduced.
The detailed design and analysis of a thyristor based capacitor discharge power supply is important in the development of pulsed power technology to accurately predict the voltage and current stress of each component. Simulation of the switching predicts how the voltage is shared by series thyristors and helps size the thyristor snubber circuits. The peak current in the thyristor is predicted. When...
In this paper, we propose a new ESD protection design methodology using a mixed-mode ESD simulation that takes account of a coupling effect for both device and circuit. As a result, we can analysis the each protection unit operation and select the optimized protection circuits in prevention of ESD failure on separated power supply units by prediction of the simulation.
When vicalloy wire (40 Fe-50 Co-10 V) is twisted, the outer areas in the wire, which undergo great stress as a result of twisting, take on a smaller coercivity. The pulse-inducing characteristics and domain wall propagation of such compound magnetic wire are described. It was found that the pulse voltage induced by large Barkhausen jumps is not proportional to the value of (H-H0), where H is the critical...
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