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Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both...
The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at low temperature of 150 oC through vapor assisted VUV treatment. This technology was expected to be applied in future body implantable devices for medical applications. The carboxyl functional groups were created on the PEEK surface during the vapor assisted VUV treatment, as well as the hydrate compound was formed on Pt...
This paper describes a novel ST-cut quartz (ST-quartz)/LiTaO3 (LT) direct bonding for surface acoustic wave (SAW) devices of next 5G mobile communication. The ST-quartz and LT were bonded to fabricate temperature compensated piezoelectric substrates using amorphous SiO2 (α-SiO2) intermediate layers. The α-SiO2 thin layer was prepared on each substrate by ion beam sputtering (IBS) to realize highly...
We propose a hermetic sealing of a glass-to-glass structure which has an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. A TGV sandwiched between two Au bumps is defined as I-structure TGV. The I-structure TGV was formed by the use of simple filling process with a resist hole and a vacuum condition. The samples were bonded at 200 °C under the vacuum of 0.50 Pa...
To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method, then the precursor alloy was immersed into the dilute...
To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method, then the precursor alloy was immersed into the dilute...
The ultrasonic vibration energy for Cu-Cu bonding by flip-chip bonding technology was evaluated in ambient air. Transmissibility of ultrasonic vibration is assumed to be different in bump structure with height or low stiffness. Therefore, we investigated the bonding strength of Cu bump with the different aspect ratio (bump height: 5 µm, 20 µm, and 40 µm). As a result, the Cu bumps with 20 µm height...
A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.
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