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The performance characteristics of kagome lattice truss core sandwich panel made of TC4 titanium alloy has been investigated in this paper. The sandwich panel was fabricated using 3D printing technology and test in out-of-plane compression. The compressive stiffness and the maximum capacity of compressive load were obtained through experiments. The plastic bending deformation of the strut members...
Drop reliability of Ball Grid Array (BGA) packages has been a concern for electronic packages to meet drop performance requirement. Joint Electron Device Engineering Council (JEDEC) has provided a board-level drop standard to investigate the drop performance of electronic packages. Simulation models have been developed to simulate the drop dynamics in drop tests. However, thus far, there is no valid...
The Scope of this paper is directed towards examining the influence of localized wall-thinning depth ratio and internal pressure on the collapse failure of some typical pressurized straight carbon steel pipes mainly used in refineries and petro-chemical plants. The investigation was achieved by conducting a parametric study using three-dimensional elastic-plastic finite element analysis (FEA). Several...
In order to analyze the increasing accumulative plastic damage of ship stiffened plate, combing the interaction coefficient of stiffener and plate, with plastic strain of damage evolution as the control quantity, the low-cycle fatigue accumulative increasing plastic damage model and low-cycle fatigue life model for stiffened plates have been derived based on the theory of damage mechanics. The fatigue...
This article uses finite element ABAQUS to set up the 3-dimensional finite element model of the dynamic tri-axial specimen, simulate the dynamical deformation behavior of the stabilized-soil under cyclic load. The main focuses on the freezing temperature of the strengthen soil of the plastic deformation. Meanwhile, the influence to the strengthen soil dynamical characteristic such as cyclic load's...
The effect of solder joint size on wafer level chip scale package reliability has been studied through simulation. A two dimensional finite element model with different solder diameter (250µm, 300µm, 350µm) was studied under accelerated thermal cycling. The failure of the solder joints under thermal fatigue loading is influenced by the solder joint size. Finite element modelling can be used to study...
Insulated gate bipolar transistors are the power semiconductors used for high current applications as a switching device. It is widely used in electrical and hybrid vehicles. It has become increasingly important to understand the reliability of these modules. The lifetime prediction is based on the assumption that the solder interconnections are the weakest part of the module assembly and that the...
A new type of double-layer plastic greenhouse was designed and analyzed, which can effectively reduce the displacement of arch, and increases the overall structural stability of arching in different direction. Using three-dimensional modeling software, the mechanical model of outside shed is built, and the stability is accurately analyzed by finite element analysis software. Calculation results show...
The processes of pipe collapse under external pressure have be calculated and simulated by means of the ANSYS FEA. It introduces the destruction theory of the pipe and some formula by API, and analyses the factors such as geometries, pressure, and its properties, which affect the capability of the resistance to the pipe collapse. The relationship between strain and stress of pipe has been descried...
This study describes board-level drop reliability of TFBGA subjected to JEDEC drop test condition which features an impact pulse profile with a peak acceleration of 1500G and a pulse duration of 0.5 ms. The solder ball is assumed as an elastoplastic model, and the other components are assumed to be linear elastic models. Both the global/local finite element method and the finite grid region method...
Shot peening is a cold working process which induces compressive residual stresses in near-surface layers and thus improves the fatigue strength of components. Shot peening involves the complex stress histories with stress reversals and cyclic loading conditions. In the study, using combined hardening model, the quasi-static simulations of the shot peening process are carried out with the help of...
Thermo-mechanical fatigue and damage has always been an issue for solder joint materials used in micro-electronic devices. Accurate prediction of the damage and crack is essential in order to predict the life of these joints. This paper presents a finite element modeling approach that is used in conjunction with Energy Partitioning Damage Evolution (EPDE) model to determine the state of damage, update...
To develop new instrument for bearing strength test, numerical simulation was carried out to study the reactive mechanism of unpaved road against the equipment load. Double-layer axisymmetrical model was built and load steps were properly disposed based on reality. Then strength reduction method was introduced in finite element analysis on the relationship between bearing strength and material parameter...
The scope of the paper is to present the result of the determination of mechanical material properties of a SAC based solder at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used to investigate the solder behaviour experimentally. Stress and strain data are recorded at high strain rates using a high resolution tensile test setup. Explicit FEM methodology...
This study calculated the stresses and deformations of the acrylic tanks used in neutrino experiment under dynamic loads and evaluated the safety level of those tanks. The diameters of those large t tanks are ??3m and the thickness of their walls are only 10mm. The measured mechanical properties are: EB=2.95GPa ??8%, SY=77.92 ??7%, SU= 102.13MPa ??12%. The stress distributions of the tanks were simulated...
Since lead was banned from the solder joints, mechanical tests of microelectronic components and modules have gained much importance not just in mobile electronics but quite in general. The standardized JEDEC drop test is commonly used. It delivers repeatable results for a wide range of loads in the components mounted on the well specified test PCB. As yet the JEDEC drop test is time consuming and...
The nanoindentation experiment is an established technique for the determination of hardness and Young's modulus of thin films. This standard data set is not sufficient to be used as input to finite element simulations , because elastic-plastic material data is being required for analysis of reliability of metal layers. Therefore stress-strain curves are being determined by fitting the force displacement...
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