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The effect of solder joint size on wafer level chip scale package reliability has been studied through simulation. A two dimensional finite element model with different solder diameter (250µm, 300µm, 350µm) was studied under accelerated thermal cycling. The failure of the solder joints under thermal fatigue loading is influenced by the solder joint size. Finite element modelling can be used to study...
The trends towards miniaturization in the electronics industry coupled with advances in flip chip technology have increased the use of flip chip on board or direct chip attach technology in many products. This is especially true for products where re-work is not an option. Reliability issues were overcome by the use of underfill to couple the chip to the substrate and subsequently significant advances...
Flip chip technology has attracted much attention in electronic industry as it fills the need for low cost, miniaturization and high performance requirements of electronic products. For such devices, package reliability under drop impact is a great concern to the manufacturers as these electronic packages are very much vulnerable to solder joint failures caused by the mechanical shock and the PCB...
Photovoltaic power is emerging as a major power resource, steadily becoming more affordable and proving to be more reliable than utilities. The photovoltaic effect is the basic principal process by which a photovoltaic (PV) cell converts sunlight into DC electricity. PV cells were developed as a spin-off of transistor technology. Photovoltaic modules are interconnected assemblies of photovoltaic cells...
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