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The field of composites mechanics, engineering and technology is relatively young, and the test methods and measurements techniques are not yet fully developed. The modeling of their mechanical properties is even further behind the experimental investigations. The study and application of composite materials is a truly interdisciplinary endeavor that has been enriched by contributions from chemistry,...
The increased commercial availability and the reduced prices of nanoparticles are leading to their incorporation in polymers and structural adhesives. This chapter outlines the principal types of nanoparticles, and the methods that may be used to disperse the particles in a polymer matrix. It discusses how nanoparticles can alter the mechanical properties (e.g., stiffness), electrical properties (e...
Silicon is one of the most commonly used materials for functional structure of microelectromechanical system. Its application is seriously restricted by reliability problems. To study the mechanical properties of silicon microstructures, an off-chip test device is designed, mainly consisting of piezoelectric drive, force sensor and displacement sensor. Secondly, a microstructure for bending test is...
Medial tibial stress syndrome (MTSS) is pain or discomfort in the leg from repetitive running on hard surfaces or forcible excessive use of foot flexors. Early diagnosis is extremely critical for proper treatment and reduces complications. Quantitative ultrasound (QUS) has been widely used to assess bone quality non-invasively, it is also radiation free, repeatable, safe, relatively accurate, and...
Since the flexural rigidity of thin semiconductor package become much lower than normal components, the warpage of the component become a much more important issue to evaluate the reliability. In this study the author's proposal a new practical shrinkage method to measure the real time curing deformation and the elastic modulus resin during the whole curing process. the thermal deformation of the...
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution...
This paper presents the measurement of decarburization of steel rods with an electromagnetic sensor using an analytical model. Loss of carbon (decarburization) at the steel surface can have a significantly detrimental effect on mechanical properties of products, since hardness, fatigue, strength, and wear properties are strongly dependent on carbon content. Currently, measurement of decarburization...
This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within electrically conductive adhesive and possible advantages of non-spherical particles distributed within the adhesive matrix. Two different commercial conductive adhesives were used in...
In this paper we review the mechanical properties and reliability results of stretchable interconnections used for electronic applications. These interconnections were produced by a Moulded Interconnect Device (MID) technology in which a specially designed metal interconnection if fully embedded with an elastic material such as polyurethane or silicone. In order to get a first impression of the expected...
In the present work the concepts of the automated system of the technological support of a combined treatment based on the ion implantation, ion alloying, plasma-ion coating, and laser modification are shown. The influence of the technological parameters for all kind of the treatment, the physical and mechanical properties of the part material before the treatment, geometrical characteristics of the...
The low-k materials have intrinsically lower modulus and poorer adhesion compared to the commonly used dielectric materials. Thus, thermo-mechanical failure is one of the major bottlenecks for development of a Cu/low-k larger die flip chip package. Furthermore, underfill selection for a Cu/low-k larger die package is also a challenging issue. In this paper, a two-dimensional finite element analysis...
Large 6 mm times 9 mm silicon dice have been successfully bonded on alumina substrate with electroplated Au80Sn20 eutectic alloy. Eutectic AuSn is one of the best known hard solders having excellent fatigue-resistance and mechanical properties. A fluxless bonding process in 50 militorrs of vacuum environment is presented. Vacuum environment is employed to prevent tin oxidation during the process....
With the relentless trend in ever-increasing number of I/Os on packages and the decreasing pitch of interconnects on packages, the task of modeling the fatigue life of the interconnects is becoming evermore challenging. This paper presents a RVE hybrid slim sector model which could be employed to meet the challenge. In this model, almost all the interconnects between chip and substrate are replaced...
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