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This paper reports the fatigue properties of Sn-Ag-Cu (SAC) and Pb-Sn solder alloys determined from isothermal shear fatigue testing and analysis of resulting data using modified Coffin-Manson fatigue model. In our study, a series of cyclic shear fatigue testing was conducted on the solder joints in PBGA assembly with variation in testing temperature, strain range, and strain rate (or cycle frequency)...
This paper reports the experimental and theoretical exploration of the fracture mechanism active in BGA lead-free solder assemblies under high speed shear fatigue test conditions. Our investigation finds that, contrary to common assumption, the crack growth in shear fatigue is not governed by shear stress but more by crack opening stress. Our theoretical analysis indicates that fracture by crack opening...
An innovative fixtureless test technique to study interfacial fatigue fracture in thin film stacks is proposed and implemented. Cyclic non-contact magnetic actuation is employed to supply the fatigue crack driving force along the interface between a released metal thin film cantilever and the supporting substrate. In-situ crack growth measurements with nanometer resolution are possible through electrical...
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