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Charge trapping and transport in the carbon doped GaN buffer of an AlGaN/GaN-on-Si high electron mobility transistor (HEMT) have been investigated. Back-gating and dynamic Ron experiments show that a high vertical leakage current results in significant long-term negative charge trapping in the buffer leading to current collapse under standard device operating conditions. Controlling current-collapse...
The ability to accurately determine the breakdown voltage of microwave transistors is critical to the design of high power microwave amplifiers. The optimal bias point and output impedance should be selected to ensure that the load line of the device during peak output power does not intersect the portion of the IV curve where the device breaks down. This paper presents a technique to determine a...
The capacitance-voltage(C-V) and switching characteristics of AlGaN/GaN HEMT has been calculated analytically. The device capacitances and switching parameters, which have been calculated, depends on the basic device parameters and terminal voltages which determine the microwave behavior of a device. The nonvariant nature of this device with drain voltage leads to better device choice for high power...
The improved dc and microwave properties of 2 mum gate length AlGaN/GaN based HEMT structures were observed after applying of a novel approach in the forming of the Schottky gate interface. The new approach uses a shallow recess-gate plasma etching of AlGaN barrier layer in combination with "in-situ" SF6 surface plasma treatment under Schottky gate. A significant improvement in both the...
The paper reports microwave properties of AlGaN/GaN HEMT fabricated on sapphire substrate. The measured transition frequency as well as maximum frequency of oscillation was taken as a figure of merit for comparison of influence of different treatment. Using 2 mum length of gate electrode 7.425 GHz transition frequency as well as 23.437 GHz maximum frequency of oscillation was achieved. Significant...
This paper shows the capability of AlGaN/GaN high electron mobility transistors (HEMTs) on (001) oriented silicon substrate with 300 nm gate length using unstuck Gamma gate for low cost device microwave power applications. The total gate periphery of 300 mum, exhibits a maximum DC drain current density of 600 mA/mm at VDS=7V with an extrinsic transconductance (gmmax) around 200 mS/mm. An extrinsic...
An analytical drain current model of a novel device architecture- AlGaN/GaN Metal Insulator Semiconductor Heterostructure Field Effect Transistor (MISHFET) has been presented to assess the microwave performance of the device for sub micron gate lengths. The model has a broad utility as it is equally applicable to HFETs as well. Both the structures have been extensively studied and a comparison is...
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