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The investigations presented in this paper illustrate the problem of modelling the average value of the convective heat transfer coefficient in the case of a free convection cooled power device with a heat sink. The total junction-to-ambient thermal resistance is dominated then by its component reflecting the heat exchange with the ambient at outer surfaces of the heat sink. Therefore, the proper...
This paper presents two methods for the efficiency measurement of a white light emitting diode (LED) without optical sensors for measuring light intensity. The proposed methods are based on the measurement of the power loss of a white LED. Because all the power loss of a white LED is transferred into heat, it is possible to evaluate the power loss by measuring the temperature of the heat sink attached...
The paper summarizes the development of a standard to measure the thermal resistance “junction-to-case” θJC of semiconductor devices with heat flow through a single path. Power switches or amplifiers are typical examples. θJC is a key performance metric to decide whether a device can be used in thermally critical applications. Hence an accurate and reproducible method to measure θJC is required. This...
This paper will act as a definitive guide on how the Junction to Case thermal resistance (RthJC) of an IGBT device is measured. This paper would provide an overview of the measurement circuit and the methods used in the measurement of an IGBT device housed in the T0247 package. We shall discuss the theory and formulas used to derive the thermal resistance of the device using the measured data. paper...
The standard procedure to measure the Rth-JC of semiconductor devices requires a thermocouple measurement of the case temperature while the IC-package is in contact with a water-cooled heat-sink. This method often produces wrong results since the measurement of the case temperature is quite prone to errors. Transient dual interface (TDI) measurements have been suggested as an alternative to overcome...
The accurate and reproducible measurement of the junction-to-case thermal resistance Rth-JC of power semiconductor devices is far from trivial. In the recent time several new approaches to measure the Rth-JC have been suggested, among them transient measurements with two different interface layers between the package and a heat-sink. The Rth-JC can be identified either in the structure functions or...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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