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Delamination in semiconductor plastic packages often happens in many interfaces within the package itself, which is mainly caused by coefficient of thermal expansion (C.T.E) mismatch between the interfaces of two materials within the package. Die attach delamination is the separation between the silicon die and die attach pad on leadframe. Die attach delamination will reduce the total area of silicon...
The high-power Light Emitting Diode (LED) can be potentially used for general lighting to alleviate the global warming problem. However, the LED issues, associated with high cost, high junction temperature, low luminous efficiency, and low reliability, have to be resolved before becoming realized. Featuring low-junction-temperature and low-cost design, a novel high-power COP (Chip-on-Plate) LED package...
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