The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In electronic product, reliability of solder joint has big impact on the function of the whole electronic product. In the design period of the package, it is important to predict solder joint thermal fatigue lifetime and analyze the effect of each factors on the lifetime of solder joint. Finite Element Analysis (FEA) based solder joint lifetime prediction method, which used Anand viscoplastic constitutive...
System-in-a-Package (SiP) aims to integrate a functional sub-system with one or more semiconductor chips along with passive components onto a substrate. SiP is transferred molded to the OEM for second level assembly using industry standards and high volume equipment. In most recent applications (high I/O density, improved electrical performance), LGA (Land Grid Array) is a very practical solution...
The technique of wafer level chip scale package (WLCSP) is similar as flip chip packages without using underfill. The weakest point is solder joint reliability issue so the package size of WLCSP in current industry is used less than 10times10 mm2. In this paper, we use 5.5times5.5 mm2 package size to take as test vehicle and focus on ball peeling and shear stresses to assume and simulate drop test...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.