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Solder joints, which serve as mechanical, thermal and electrical interconnections between the electronic packages and the printed circuit board (PCB), are the most vulnerable part in a portable product when the product is subjected to mechanical loading. Therefore, a comprehensive study of mechanics behavior of solder joints is indispensable for understanding the reliability of portable electronic...
The purpose of this paper is to compare the ability of solder joint with different shape (hourglass-shaped, barrel-shaped and cylinder-shaped) to resist destruction under drop impact loadings. Three 3D finite element models of VFBGA (very-thin-profile fine-pitch BGA) packages, including different shape of solder joints, are established respectively. According to the condition B in the drop test standard...
The technique of wafer level chip scale package (WLCSP) is similar as flip chip packages without using underfill. The weakest point is solder joint reliability issue so the package size of WLCSP in current industry is used less than 10times10 mm2. In this paper, we use 5.5times5.5 mm2 package size to take as test vehicle and focus on ball peeling and shear stresses to assume and simulate drop test...
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