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The reliability of board-level solder joint that provides the mechanical and electrical connections between the chip and print circuit board is such an import issue that they can result in the failure of the whole equipment under real service condition. The multiple stresses in service environment such as temperature and vibration loadings can cause the fatigue failure of solder joints easily. In...
The 3D finite element analysis models of lead-free solder joint with compliant layer in wafer level chip scale package (WLCSP) were developed. Based on the models the lead-free solder joint with compliant layer stress and plastic strain were analyzed under thermal cycle. The results showed that: under thermal cycle loading conditions, the equivalent stress and equivalent plastic strain of the lead-free...
Thinner organic BGA packages typically lead to higher warpage before surface mount which, after reflow, causes package corner solder joints (SJ) to have higher stand-off compared to solder joints in the package center. Hence the solder joints at package corners can change from typical barrel shape to an elongated hour-glass shape. Conventional understanding of the impact of SJ height on temperature...
The 3D finite element analysis models of lead-free solder joint with compliant layer in wafer level chip scale package (WLCSP) were developed. Based on the models the lead-free solder joint with compliant layer stress and plastic strain were analyzed under thermal cycle. The results showed that: under thermal cycle loading conditions, the equivalent stress and equivalent plastic strain of the lead-free...
High reliability is prerequisite requirement for the solders in the space electronic products for its inconvenient in-orbit servicing. Based on the finite element method, the reliability of connector solder joints in cable out of a space craft is analyzed when the environment temperature varies in a large scale range within a day, in which the temperature may reach 120 °C in the daylight but decrease...
Environmental Stress Screening (ESS) is usually referred to the process of exposing a product to environmental stresses for detecting and eliminating latent defects made in manufacturing process. The common ESS profiles are using thermal cycling, random vibration or their combinations as the screening stresses. Various guidelines and standards have been available for determining an ESS profile. Nevertheless,...
Board level reliability is more representative of the reliability of a package operating in the field and fatigue due to loading with cyclical stresses is a major concern in solder joint reliability. In this paper, the board level reliability of two types of BGA packages CTBGA 228 and CABGA 160 under accelerated temperature cycling stress had been studied; each package contains a daisy chained die...
The system-in-package (SiP) is among the popular designs which meet the trend of integrated circuit (IC) development. The SiP structure investigated in this study includes seven sub-chips attached to the chip carrier, and polymer was applied around the chips. The polymer is an exceptional stress buffer layer reducing the maximum shear stress in the solder joints, but it also affects the copper interconnection...
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