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The purpose of this paper is to study the temperature effect on the Print Circuit Board (PCB) and the solder joints in the vehicle under working condition of the engine. Thermal-stress test has been used to evaluate the reliability or fatigue life of the PCB using commercially available Finite Element Analysis software, ANSYS. The thermal deformation distribution of the PCB and stress of the solder...
In this paper, a method of solder joint thermal fatigue life analysis using transient thermal analysis is introduced, and also a case study of temperature shock test to an CPU module. The results show that this method obtained the temperature load under actual use, which is closer to engineering problems. The module's maximum temperature variation range is 50D-132D. Under the temperature load, the...
This paper will focus on the fast assessment methodology of FBGA fatigue life through simulation and physics of failure (PoF) analysis under thermal cycle. The structure of fine pitch ball grid array (FBGA) that has been investigated, and been modeled by ANSYS to compare with experimental data. There are two temperature cycling will be used, one is used to verify FEA model, and the other one is used...
A novel stacked converter construction technology, Power Sandwich that lends itself towards automation and high power densities has been proposed. In Power Sandwich technology, new double-sided SMT x-dim components that have uniform height are stacked between planar substrates in a few stack layers. Double-sided x-dim components are soldered to both top and bottom sides. The concept of Power Sandwich...
Properties of body-centered tetragonal beta-Sn are highly anisotropic. The crystal orientation of the beta-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The...
Die size effects on chip package interaction for Cu/ultra low-k interconnect in flip chip package were investigated using mechanical and thermal analysis. The analytical and the theoretical study suggested that the die size effects were not caused only by the mismatch in CTE between die and substrate. By considering the number of bonding solder and its mechanical property during the cooling process,...
Electronic assemblies in field use are exposed to a wide range of environmental loads. The interaction of combined loads has to be considered in lifetime estimates of electronic packages. In this paper, we discuss lifetime prediction for lead-free soldered flip chips under vibration load in different temperature environments in terms of solder joint fatigue. Parameters for lifetime modeling are obtained...
This paper presents a reliability model for wafer level chip scale packages (WLCSP) assembled with Sn4%Ag 0.5%Cu (SAC 405) solder. The reliability model is based on a creep constitutive model that takes into consideration the dimensions of the solder joints and a thermo-mechanical fatigue crack growth model. The creep constitutive model was derived from over 250 constant load creep tests performed...
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