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The market demand of discrete is very big in semiconductor package. A lot of discrete package is transferring to green compound which are surface mounting design and high voltage power application. It must pass the relative electrical performance and standard JEDEC Level testing. Currently green molding compound always meet some H(3)TRB failure on high voltage device and delamination issue after MSL1...
Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due...
In this paper, we analyze the rise time and dwell time impact on 16A-600V high temperature Triacs reliability subjected to power cycling. Experimental tests, performed on two TO-220 packages (insulated or not), show that rise time and dwell time have a negligible contribution on Triacs lifetime. Failure analysis confirms that the physical failure mode (the die-attach fatigue) and the failure location...
The equivalent circuit model for optical sensor with quantum dot quantum well hybrid structure is established to investigate the small signal characteristic further. The parasitical parameters are introduced to the equivalent circuit model of optical sensor to investigate the electrical reliability and the performance of optical detector. The 3D multi-chip module (3D-MCM) packaging models of FEA for...
Copper/Low-k structures are the desired choice for advanced integrated circuits (ICs) as the IC technology trends moving toward finer pitch, higher speed, increased integration and higher performance ICs. Copper interconnects with low-k dielectric material improves the ICs performance by reducing interconnect RC delay, cross talk between adjacent metal lines and power loss. However, low-k materials...
The technique of wafer level chip scale package (WLCSP) is similar as flip chip packages without using underfill. The weakest point is solder joint reliability issue so the package size of WLCSP in current industry is used less than 10times10 mm2. In this paper, we use 5.5times5.5 mm2 package size to take as test vehicle and focus on ball peeling and shear stresses to assume and simulate drop test...
To increase miniaturization, CSWLP (chip size wafer level packaging) has been developed. However, the difficulty to get good solder joint reliability leads to manufacture only small CSWLP modules. Different underfill methods are evaluated here, by measurements and simulations: results prove that underfill is necessary, but a bad choice can also decrease the reliability. An original method called ldquore-enforcementrdquo...
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